Jiangsu, China
Main Products:
Year of Establishment:
2019-09-12
Repeat Buyers Choice:
80%~100%
Address:
Room 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital:
100,000,000 RMB
Main Markets:
Europe
Die Bonder, Wire Bonding manufacturer / supplier in China, offering 8-Inch Silicon Wafer Semi Chip Standard Chip High End Lithography/Litho Machine, Precision Laser Marking Technology for Metal and Plastic Surfaces, Advanced Die Bonding Machine for Optimal Solidification Performance and so on.
Gold Member
Audited Supplier
