Jiangsu, China
Year of Establishment:
2019-09-12
Repeat Buyers Choice:
80%~100%
Address:
Room 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital:
100,000,000 RMB
Main Markets:
Europe
OEM/ODM Service
Overseas Agent / Branch

Die Bonder, Wire Bonding manufacturer / supplier in China, offering High Precision Automatic SMT Red Glue Dispensing Equipment, Laser Marking Machine/Engraver on Metal and Non Metal Materials, Laser Induced Epitaxial Growth Machine with Beam Combination Technology and Modulation Technology and so on.

Diamond Member Since 2023

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Others Wafer chip equipment

Total 1 Others Wafer chip equipment Product