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High Efficiency High Flexibility Die Bonding Machine Process for Placing a Chip on a Package Substrate

Name: High Efficiency High Flexibility Die Bonding Machine Process for Placing a Chip on a Package Substrate
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: pfYrbXJUvRcy
Price: 100000.00 USD
Availability: InStock

High Efficiency High Flexibility Die Bonding Machine Process for Placing a Chip on a Package Substrate pictures & photos

After-sales Service:	Provided
Condition:	New
Speed:	High Speed
Precision:	High Precision
Certification:	ISO
Warranty:	12 Months

Customization:	Available \| Customized Request

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