High Precision Linear Motor Fiber Laser Cutting Machine

• Customization: Available
• After-sales Service: Online Service
• Warranty: 12 Months
• Cooling System: Air Cooling
• Technical Class: Continuous Wave Laser
• Applicable Material: Metal
• Structure Type: Gantry Type
• Laser Classification: Semiconductor Laser
• Model: Pcf0606-L-a
• Weight: 1800kg
• Transport Package: Customized or Wooden Box Packaging
• Trademark: Himalaya
• Origin: China
• Production Capacity: 50000

Product Description

High Precision Linear Motor Fiber Laser Cutting Machine

 

Product Description

 

1.Gantry+ dual linear motor driving structure, with powerful thrust output, max acceleration 1.5G, improves the working efficiency and curve processing art greatly;
2.Machine bed is made of precise marble platform and strong welded rectangular tube, with high precision and high stability, which effectively eliminates the vibration created by high-speed cutting;
3.Professional laser cutting system: it can do both flat sheet cutting and fully- automatic coil-flat sheet cutting; with the function of typography and sharp corner smooth processing; supports the function of piercing and engraving in high speed;
5.Integrated design, compact and rational layout, saving plant land;
6.Advanced laser generator, stable output, perfect cutting quality; Photoelectric conversion rate over than 30%; Easy to realize smooth cutting with assistant gas, low running cost.

 

 

 

Product Technical Specification:

Model	Laser Power	Working area	Overall dimension	c	Repeated positioning accuracy	Cutting thinkness	Laser wavelength	Gross powe	Supply voltage	working environment
PCF0606-L-A	500~1500W	600×600mm	1800×1470×1900mm	1800kg	±0.003	≤2mm	1064mm	10kW	AC220V±10% 50Hz	Temp:10~45ºC Humidity:<90% clean

Applicable materials: 
Metal materials such as Stainless steel, Aluminum alloy, Titanium alloy, Galvanize sheet, Brass etc.

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
 

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:Why choose us?
A3:OEM/ODM Designing.