High Quality Automatic FPCB Laser Cutting and Placing Machine

• Customization: Available
• After-sales Service: Online Service
• Warranty: 12 Months
• Application: Automotive Industry
• Cooling System: Air Cooling
• Technical Class: Continuous Wave Laser
• Applicable Material: Metal
• Structure Type: Desktop
• Laser Classification: Semiconductor Laser
• Uph: Customized
• Positioning Accuracy: <5μm
• Cutting Accuracy: ±30μm
• Trademark: Himalaya
• Origin: China
• Production Capacity: 50000

Product Description

High Quality Automatic FPCB Laser Cutting and Placing Machine

 

Product Description

 Double-click for dual-station synchronous high-speed and precise cutting of optical materials.
Fully automatic cutting, circuit board separation, placement, and automatic loading and unloading.

Features:
1.The section of the incision is colorless and does not protrude; Straight cutting without a back angle; It's easier to cut back partitions; Ultraviolet cutting of low soot.
2.Combined cutting accuracy ±30 microns;CCD positioning accuracy < 5 microns.
3.Compatible with a variety of FPCB substrates; Quick switching between different products; Efficient software supports multiple languages.
4.Customized loader that perfectly fits the product; Comprehensive earthquake prevention design to ensure system stability and reliability.
5.Single camera positioning to realize the recognition of the whole substrate feature points and Mark paints; Double camera tracking in real time to enable monitoring of cutting effects and swing movements.
6.High speed vision system realizes the sorting of defective products;4PNP module 16 suction nozzlefor high speed and high precision placement

Specifications:

UPH	Positioning Accuracy	Laser Spot	Cutting Accuracy	Laser Power	Machine Power	Power Supply	Equipment Dimensions
Customized	<5μm	Φ=12μm	±30μm	10W/15W/20W/30W	≤5kW	AC 380V	2500×1700×1900mm∧3

Domains of Application:
Various types of Flexible Printed Circuit Board (FPCB) substrates

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
 

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:Why choose us?
A3:OEM/ODM Designing.