High Quality 12inch Fully Automatic Soft Solder Die Bonding Machine

• Customization: Available
• After-sales Service: Free Training
• Condition: New
• Speed: Super High Speed
• Precision: High Precision
• Certification: RoHS, CE
• Warranty: 24 Months
• Automatic Grade: Automatic
• Type: Ultra High-speed Chip Mounter
• Product Name: Die Bonding Machine
• Item Number: SD8012
• Suitable with: Pdfn,To252-8r,To220/247/3p, Photovoltaic Devices
• Bonding Pressure: 30-300g (Programmable)
• Track Width: up to 70mm
• Wafer Size: 12/ 8/6 Inches
• Tin Wire Diameter: 0.25-1mm
• Tin Delivery Mode: Sn, Write, Press (Optional)
• Transport Package: Wooden Box by Sea Shipping
• Specification: standard package
• Trademark: Himalaya
• Origin: China
• Production Capacity: 5000

Product Description

High Quality 12inch Fully automatic soft solder die bonding machine 
 

Product Description

This equipment is a soft solder die bonder designed for thermal die bonding of TO power devices. This equipment is a new architecture designed for 12-inch wafer structure and is compatible with 8-6-inch products. It also takes into account the placement of large-size high-density lead frames, such as PDFN, TO252-8R, TO220/247/3P, photovoltaic devices, SOP, DPAK matrix, etc.

Detailed Photos

              

Product Parameters

System Capabilities
Productivity
6-9k*
(Double Tin + Matrix Lead Frame PDFN-10R)
Solder Thickness
1mil-3mil
Wafer Tilt
< 2mil (Chip Size <150x150mil)
<1° (Chip Size >150x150mil)
Soft Solder Voids
2% (Single Void) & 5% (Total Wafer Area)
Soft Solder Coverage
100% (Wafer to Pad Edge >10mil)
XY Position Accuracy
± 1.5mil (38μm)
Angular Deflection
±2°
Material Handling Capabilities
Wafer Size
20x20-560x560mil
(0.5x0.5-14x14mm)
Substrate Size
Length
4.33"-11.81" (110-300mm)
Width
0.47"-4" (12-102mm)
Thickness
4-39mils (0.1-1mm)
Box size
Length
4.33"-11.81" (110-300mm)
Width
0.63"-4.72" (16-120mm)
Height
2.68"-6.30" (68-160mm)
Machine size and weight
Width x depth x height
1,900x1,400x1,700mm3
Weight
Approximately 1600KG

Bonding system
Bonding pressure
30-300g (programmable)
Wafer system
Wafer size
12 inches, 8 inches (optional), 6 inches (optional)
Solder handling capacity
Tin wire diameter
0.25-1mm
Tin delivery mode
Sn, write, press (optional)
Heating track
Heating zone
8
Cooling zone
3
Maximum operating temperature
Preheating zone
450°C
Sn/bonding zone
450°C
Cooling zone
450°C
Temperature accuracy
±3°C
Power system
Compressed air
250 LPM @ 3bar, minimum 3bar
23 LPM @ 3bar, minimum 3bar,
Mixed air
15%H2 + 85%N2
Vacuum
>-8bar
Voltage
220/240 VAC
Frequency
50/60 Hz
Maximum load current
10A |29A
Power consumption
Approximately 1,100W
Approximately 2,200W


 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonding,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
 

Packaging & Shipping

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:Why choose us ?
A3:OEM/ODM/Designing.