Equipment Factory Rapid Wire Bonding Machine for Production Line

• Customization: Available
• After-sales Service: Free Training
• Condition: New
• Speed: Super High Speed
• Precision: High Precision
• Certification: RoHS, CE
• Warranty: 24 Months
• Automatic Grade: Automatic
• Type: Ultra High-speed Chip Mounter
• Product Name: Wire Bonding Machine
• Item Number: Rapid-1
• Wire Diameter: 0.6 Mil to 2.5 Mil Copper, Silver O
• Pattern Recognition: Advanced Vision Scanning Engine
• CCD Camera: 2X Vision Magnification (2X & 6X)
• Transport Package: Wooden Box by Sea Shipping
• Specification: standard package
• Trademark: Himalaya
• Origin: China
• Production Capacity: 5000

Product Description

Equipment factory Rapid wire bonding machine for production line

Product Description

Technical Specifications:
Wire Bonding Capability
Ultra-fine Pitch Gold Wire Bonding: 35 μm Inline Bond Pad Pitch
Wire Diameter: 0.6 mil to 2.5 mil Copper, Silver or Gold
Note:
Gas shield is required for copper or silver wire bonding
Wires with diameters greater than 2.0 mil require thick wire tools

Detailed Photos

Product Parameters

Specification

Bonding area

X-axis: 56 mm
A-axis: 80 mm (standard), 87 mm (enlarged), 90 mm (extra large)
Total Bonding Accuracy
2.0 μm @ 3 sigma
Pattern Recognition
Advanced Vision Scanning Engine
CCD Camera
· 2x Vision Magnification (2x & 6x)
·Programmable High-power Magnifier Focus
Advanced Process Capabilities
Compatible with Traditional Processes
ProBond, ProStitch Stranding Process
Advanced Wire Bonding and Low-arrest Consistency of the Power Series
Compatible with Standard Processes of All Existing Models
Process Programs Are Not Backward Compatible, Programs Edited on New Models Cannot Run on Current Models
Wire Capabilities
Longest Wire Citations:
7.6 mm for 1.0 mil wire
3.0 mm for 0.6 mil wire
Minimum wire height
Ultra low wire for "Force" series low wire
40 pm for 0.6 mil wire
Twist and turn
Wire length < 2.54 mm: 25 μm @ 3 sigma
Wire length > 2.54 mm: ± 1% wire length @ 3 sigma
Style changeover time
If wire style remains the same, the following style changeover time applies.
If wire style changes, the following style changeover time doubles.
Same type of leadframe: <4 minutes
(including time required to change heating block, platen and load program from disk)
Different type of leadframe: <8 minutes
(including time required to change wireframe width and length, change cassette size, change heating block, platen and load program from disk)
Packaging equipment network
Standard-K&s Connect
K&S Connect can automatically transmit data generated by RPM for traceability
Optional-KNet PLUS
KNet PLUS helps improve efficiency, production capacity and yield rate by real-time monitoring of equipment status, collecting data and performing local or remote detection through user network. Please contact your local K&S sales representative for more information.
Material Handling Capabilities:
Package/Lead Frame Sizes
Length:
90 to 300 mm
(Lead frames shorter than 100 mm require additional short cassette handling tool)
Width:
15 to 92 mm (Standard)
15 to 95 mm (Enlarged)
25 to 100 mm (Extra Large)
Thickness:
0.10 to 0.9 mm
(Lead frames thicker than 0.9 mm require additional Flat Boat tool)
Pad Depth: Up to 2.3 mm
Cassette Sizes
Width
20 to 101 mm
Length:
50 to 178 mm
127 to 305 mm
Height:
Maximum Weight: 5.22 kg
Slot Pitch: 127 to 25 mm
Human Machine Interface
Display
21.5″ Color LCD display
Durable operator panel
User-friendly interface with function keys, dedicated keys and comfortable mouse
Industry-proven user interface
Simple drop-down menus with color-coded wire groups for easy programming and teaching
Equipment operating requirements
Minimum air pressure: 3.52 Kg/sq.cm.(50 psi)
Rated air consumption (flow)
185 liters/minute @4.6 Kg/ sq.cm (6.5 CFM @ 65 psi)
Shielding gas consumption (flow) for copper and silver wire welding
Minimum 0.6 liters/minute
Maximum 15 liters/minute
Typical 11 liters/minute
Input voltage
Standard:
200 to 240 V /AC:-15% to +10%
Unidirectional 50 /60 Hz(+/-3 Hz)
Or:
100 to 115 V /AC: -15% to +10%
Unidirectional 50 /60 Hz (+/-3 Hz)
Rated power consumption
1.5 KV/A (typical).2.6 KV/A (maximum)
Footprint
Basic equipment footprint plus material handling system
889mm wide x1009mm deep (35"x 39.7")
Net weight:
590 kg (1300 lbs)
Equipment plus outer packaging box 670 kg (1477 Ibs)




 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonding,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
 

Packaging & Shipping

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:Why choose us ?
A3:OEM/ODM/Designing.