Jiangsu, China
Main Products:
Year of Establishment:
2019-09-12
Repeat Buyers Choice:
80%~100%
Address:
Room 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital:
100,000,000 RMB
Main Markets:
Europe
Die Bonder, Wire Bonding manufacturer / supplier in China, offering High Quality Wafer Back Grinding Machine Equipped with Wafer Level Handling Robot, High Quality Vertical Furnaces Target Semiconductor SMT Dispensing and Filling Machine, High Quality Automatic Silicone Glue Dispensing Equipment for Semiconductor Industry and so on.
Diamond Member
Since 2023
Suppliers with verified business licenses
Audited Supplier
