IC Automatic Chip Setter Machine with Operating System: Touch Screen+Operation Buttons

• Customization: Available
• After-sales Service: 1 Year
• Function: High Temperature Resistance
• Model NO.: IC-01
• Demoulding: Slide
• Condition: New
• Certification: ISO
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Driven Type: Electric
• Mould Life: 300,000-1,000,000 Shots
• Product Name: IC Lamination Machine
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• OEM/ODM Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

IC Lamination Machine

 

IC chip setter, also known as automatic chip setter, is an important part of achieving automation in semiconductor IC packaging production. The main processes of IC packaging include: feeding, rail transportation, chip placement, and preheating. The chip setter mainly plays a role in automatic chip placement and heating during the production process, and its completion quality will directly affect the efficiency and quality of the next step of packaging. The current packaging technology requires automatic lamination machines to complete lamination work at high speed, accurately, and automatically preheat evenly.

Main Features

Equipment function: Using a robotic arm to automatically grasp and discharge the lead frame;

Applicable packaging: all packaging;
Control system: PLC (Omron)
Operating system: touch screen+operation buttons;
Safety protection system: emergency stop button device, light curtain protection device, and three side safety door design. After the protective door is opened, the system stops all actions, and after the door is closed, it resumes continuous action to protect personal safety.
 

Category	Automatic Lead Frame / Film Arrangement Machine	Semiconductor Automatic Chip Laying Machine
Equipment Name (English)	Automatic Lead Frame / Film Arrangement Machine	Semiconductor Automatic Chip Laying Machine (Also called: Automatic Chip Placement Equipment)
Core Function	Automatically grasps and discharges lead frames using a robotic arm	Automatically performs chip laying (placement) and preheating during IC packaging
Packaging Compatibility	Applicable to all types of packaging	N/A (specific to IC chip and lead frame layout)
Key Process Role	Handles lead frame feeding & arrangement in the packaging line	Performs chip laying & preheating, which directly impacts the efficiency and quality of subsequent packaging steps
Main Processes in IC Packaging (Related)	N/A	Feeding → Rail Transportation → Chip Laying & Preheating
Control System	PLC (Omron)	(Not specified, typically also PLC-based in industry)
Human-Machine Interface (HMI)	Touch Screen + Operation Buttons	(Commonly includes touch screen & buttons; not specified here)
Safety Protection Features	- Emergency Stop Button - Light Curtain Protection - Three-Side Safety Door Design - System stops all actions when door is opened; resumes after door is closed	(Typically includes similar safety features; not specified here)
Safety Mechanism Description	System ensures personal safety by stopping operations immediately upon opening protective doors, and only resumes after doors are securely closed	N/A (Assumed similar safety compliance for high-speed automation)
Technology Highlights	- Fully automated grasping & discharging - Designed for high reliability in lead frame handling	- High-speed, high-precision chip placement - Uniform and automatic preheating of chips - Critical for next-stage packaging quality
Industry Application	Semiconductor / Electronics Manufacturing IC Packaging Lines	Semiconductor IC Packaging Advanced Packaging Automation
Performance Requirements (Industry Trend)	N/A	- High-Speed Operation - High Accuracy - Uniform Preheating - Continuous & Stable Production

 

 

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.