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Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu, China
Main Products:
Die Bonder , Wire Bonding , Laser Marking(ID IC Wafer) , Laser Grooving , Laser Cutting , ...
Year of Establishment:
2019-09-12
Repeat Buyers Choice:
80%~100%
Address:
Room 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital:
100,000,000 RMB
Main Markets:
Europe
OEM/ODM Service
Overseas Agent / Branch
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Die Bonder, Wire Bonding manufacturer / supplier in China, offering SLA Series Nitrogen/Hydrogen Mesh Belt Furnace, Slkj Series High Precis Thick Film Sintering Furnace, Optical Fiber Laser Coding Machine and so on.

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Mr. Jack
Deputy General Manager
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Semiconductor Equipment

Total 521 Semiconductor Equipment Products
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Substrate Display Glass C500 Semiconductor Equipment Is Mainly Used in Display Industry
Substrate Display Glass C500 Semiconductor Equipment Is Mainly Used in Display Industry
FOB Price: US $1,000,000-3,000,000 / Piece
Min. Order: 1 Piece
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Factory Custom-Made C600 Single Wafer Cluster System for Thin Epl B-Si/P-Si/Sib Hm
Factory Custom-Made C600 Single Wafer Cluster System for Thin Epl B-Si/P-Si/Sib Hm
Min. Order: 1 Piece
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C600 Furnace Epi for 3D Si / Sige Epi in 3D DRAM with Vacuum Load-Lock in Mini Batch Chambers
C600 Furnace Epi for 3D Si / Sige Epi in 3D DRAM with Vacuum Load-Lock in Mini Batch Chambers
FOB Price: US $1,000,000-3,000,000 / Piece
Min. Order: 1 Piece
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Auto-Theta Alignment Water System Da1201 IC Linear High Precision Die Attach Semiconductor Equipment
Auto-Theta Alignment Water System Da1201 IC Linear High Precision Die Attach Semiconductor Equipment
FOB Price: US $100,000-1,000,000 / Piece
Min. Order: 1 Piece
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High Speed Precision Automatic Semiconductor Equipment for IC Package Wafer Die Bond Die Bonding Attach
High Speed Precision Automatic Semiconductor Equipment for IC Package Wafer Die Bond Die Bonding Attach
FOB Price: US $100,000-1,000,000 / Piece
Min. Order: 1 Piece
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Semiconductor Packaging Equipment/LED/High Precision Die Bonder/Die Bonding Machine / Die Attach
Semiconductor Packaging Equipment/LED/High Precision Die Bonder/Die Bonding Machine / Die Attach
FOB Price: US $100,000-1,000,000 / Piece
Min. Order: 1 Piece
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High Precision Automatic Wafer Eclectic Bonder Die Bonder Bonding Machine
High Precision Automatic Wafer Eclectic Bonder Die Bonder Bonding Machine
Min. Order: 1 Piece
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Dual Dispensing System Die Bonder Die Bonding Machine for Semiconductor Industry
Dual Dispensing System Die Bonder Die Bonding Machine for Semiconductor Industry
FOB Price: US $100,000-1,000,000 / Piece
Min. Order: 1 Piece
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Automatic High Precision Die Bonder Die Bonding Machine for Qfp/Lqfp/Qfn
Automatic High Precision Die Bonder Die Bonding Machine for Qfp/Lqfp/Qfn
FOB Price: US $100,000-1,000,000 / Piece
Min. Order: 1 Piece
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Automatic Die Bonder Equipped with Fully Automatic Feeding and Discharging Magazine Processing System
Automatic Die Bonder Equipped with Fully Automatic Feeding and Discharging Magazine Processing System
FOB Price: US $100,000-1,000,000 / Piece
Min. Order: 1 Piece
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High Speed Automatic Die Attach Machine Die Attachment Equipment Die Bonder
High Speed Automatic Die Attach Machine Die Attachment Equipment Die Bonder
FOB Price: US $100,000-1,000,000 / Piece
Min. Order: 1 Piece
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High Speed Precision Automatic Semiconductor Equipment to IC Package Wafer Die Bond Die Bonding Attach
High Speed Precision Automatic Semiconductor Equipment to IC Package Wafer Die Bond Die Bonding Attach
FOB Price: US $100,000-1,000,000 / Piece
Min. Order: 1 Piece
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Semiconductor Packaging Equipment LED to IC Die Bonder Die Bonding Machine Die Attach
Semiconductor Packaging Equipment LED to IC Die Bonder Die Bonding Machine Die Attach
FOB Price: US $100,000-1,000,000 / Piece
Min. Order: 1 Piece
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Da1201FC Automatic Die Bonding Flip Chip and Die Attach Bonder for Soic/So/Qfn/BGA/LGA
Da1201FC Automatic Die Bonding Flip Chip and Die Attach Bonder for Soic/So/Qfn/BGA/LGA
Min. Order: 1 Piece
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Flip-Chip/High-Precision Die Attach Packaging Machine Chip Mounter Equipped with Die Attach System
Flip-Chip/High-Precision Die Attach Packaging Machine Chip Mounter Equipped with Die Attach System
FOB Price: US $100,000-1,000,000 / Piece
Min. Order: 1 Piece
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Factory Wholesale Fully Automatic High-Speed Flip Chip and Die Bonding in One Machine
Factory Wholesale Fully Automatic High-Speed Flip Chip and Die Bonding in One Machine
FOB Price: US $100,000-1,000,000 / Piece
Min. Order: 1 Piece
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Highly Automated IC Chip Packaging Die Bonder Machine Customized Based on Customer Requirements
Highly Automated IC Chip Packaging Die Bonder Machine Customized Based on Customer Requirements
FOB Price: US $100,000-1,000,000 / Piece
Min. Order: 1 Piece
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China Manufacturer Semiconductor Flip Chip Package Die Bonder Die Attach Bonding Machine
China Manufacturer Semiconductor Flip Chip Package Die Bonder Die Attach Bonding Machine
FOB Price: US $100,000-1,000,000 / Piece
Min. Order: 1 Piece
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High Precision Semiconductor Equipment Die Bonding Machine Fully Automatic
High Precision Semiconductor Equipment Die Bonding Machine Fully Automatic
Min. Order: 1 Piece
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Semiconductor Equipment Die Bonding Machine Fully Automatic Die Bonder for SIP/BGA/LGA/Qfn
Semiconductor Equipment Die Bonding Machine Fully Automatic Die Bonder for SIP/BGA/LGA/Qfn
FOB Price: US $100,000-1,000,000 / Piece
Min. Order: 1 Piece
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Automatic High Precision Die Bonder Die Bonding Machine for Dfn/Mems/Sop-8/Tssop
Automatic High Precision Die Bonder Die Bonding Machine for Dfn/Mems/Sop-8/Tssop
FOB Price: US $100,000-1,000,000 / Piece
Min. Order: 1 Piece
Contact Now
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High Precision Pick and Place Machine Flip Chip Die Bonder Semiconductor Bonding Equipment
High Precision Pick and Place Machine Flip Chip Die Bonder Semiconductor Bonding Equipment
FOB Price: US $100,000-1,000,000 / Piece
Min. Order: 1 Piece
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Wafer Size 6"- 8" Customized High Precision Semiconductor Die Bonder Die Bonding Machine for IC Package
Wafer Size 6"- 8" Customized High Precision Semiconductor Die Bonder Die Bonding Machine for IC Package
FOB Price: US $100,000-1,000,000 / Piece
Min. Order: 1 Piece
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Dual Dispensing System Fully Automatic Submicron Placement Accuracy Eutectic Die Bonding Machine
Dual Dispensing System Fully Automatic Submicron Placement Accuracy Eutectic Die Bonding Machine
FOB Price: US $100,000-1,000,000 / Piece
Min. Order: 1 Piece
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