Jiangsu, China
Year of Establishment:
2019-09-12
Repeat Buyers Choice:
80%~100%
Address:
Room 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital:
100,000,000 RMB
Main Markets:
Europe
OEM/ODM Service
Overseas Agent / Branch

Die Bonder, Wire Bonding manufacturer / supplier in China, offering High-Power Metal Cutting Fiber Laser Cutting Machine, Automatic Paper Box Forming and Cartoning Machine, Infrared Picosecond Laser Cutting Machine and so on.

Diamond Member
Audited Supplier Audited Supplier
Supplier Homepage Products Semiconductor Equipment

Semiconductor Equipment

Total 522 Semiconductor Equipment Products