Jiangsu, China
Main Products:
Year of Establishment:
2019-09-12
Repeat Buyers Choice:
80%~100%
Address:
Room 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital:
100,000,000 RMB
Main Markets:
Europe
Die Bonder, Wire Bonding manufacturer / supplier in China, offering Precision Engineering Wafer Back Grinding Machine for Customization, Efficient Tcb Ncp/Ncp/Tc-Cuf C2 and C4 Bonding Solutions, Desktop Automatic Glue Dispensing Machine Semiconductor Dispenser Device with Visual Function and so on.
Gold Member
Audited Supplier
