| Customization: | Available |
|---|---|
| After-sales Service: | Provided |
| Function: | High Temperature Resistance, Anti-Corrosion |
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| Wafer Size | 200mm Wafer(300mm selectable) |
| Wafer thickness | 0.1mm~5mm |
| Resolution | 2μm L/S |
| Linewidth accuracy | ±10% |
| Depth of focus | 20μm |
| Front engraving accuracy | 0.5μm |
| Capacity | 150WPH |
| Imaging material | photoresist(PR) |
| Light source spectrum | 365nm |
| Exposure energy | 20-1000mj/cm² or higher |
| Reticle | 9 inch |
| Applicable process | positive exposure, positive Alignment |
| Single power supply | AC380V-50HZ(Primary equipment) |
| Weight per unit | 6500kg |
| Overall dimension(L×W×H) | Host machine:3100mmL×1750mmW×2750mmH Accessory equipment:1300mmL×880mmW×1,650mmH |
| Temperature/humidity | 22ºC±1ºC,30%-55% |
We are an ISO 9001-certified manufacturer and innovator specializing in semiconductor equipment, with 6 registered utility model patents (UM Patents) in China. Our patented technologies cover:
Semiconductor annealing systems
Cleaning equipment for semiconductor etching
UV debonding machines
And more .
Backed by ISO 9001 quality management, we ensure high precision, reliability, and efficiency in semiconductor manufacturing processes. Our R&D-driven solutions enhance production yield and cost-effectiveness for global clients in IC packaging, MEMS, and advanced wafer processing.
Partner with us for cutting-edge, patent-protected semiconductor equipment tailored to your needs.
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:Why choose us?
A3:OEM/ODM/Designing service.
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