Fully Automatic Laser Grooving Equipment for Semiconductor Wafers

• Customization: Available
• After-sales Service: Provided
• Function: High Temperature Resistance, Laser Grooving
• Model NO.: Himalaya-6688
• Demoulding: No
• Condition: New
• Certification: RoHS, ISO, CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Driven Type: Electric
• Mould Life: Laser Warranty for One Year
• Product Name: Laser Grooving Equipment
• Feature 1: High Precision
• Feature 2: High Efficiency
• OEM/ODM Service: Provided
• Transport Package: Complies with International Logistics Standards
• Specification: 1400 x2400x 2440 (including tricolor light)
• Trademark: Himalaya
• Origin: China

Product Description

 Fully Automatic Laser Grooving Equipment for Semiconductor Wafers

This machine is a specialized equipment for semiconductor wafer Laser Grooving, designed as a fully automatic model, and adopts a plug type (customized special) material box feeding method. The equipment integrates high-performance, high-power, and ultra fast lasers, providing long-term stable and high-quality laser output performance. It is equipped with high-precision robotic arms and motion platforms to ensure accurate processing.

Parameter	Profile (All)	Section 1	Section 2	Section 3	Total (Sec 1-3)	Maximum	Minimum	Average	Std Dev (1σ)	3 Sigma (3σ)
Length (um)	510.713	75.024	59.881	73.647	208.553	75.024	59.881	69.518	6.837	20.511
Height Difference (um)	0.949	1.492	1.715	52.655	55.862	52.655	1.492	18.621	24.066	72.198
Average Height (um)	48.089	12.328	6.09	33.887	52.305	33.887	6.09	17.435	11.909	35.727
Angle (°)	0.106	1.14	1.64	35.563	38.343	35.563	1.14	12.781	16.111	48.332
Cross-sectional Area (um2)	618.489	152.529	65.614	115.051	333.194	152.529	65.614	111.065	35.595	106.784
R Value	24576.14	927.494	367.342	2503.567	3798.403	2503.567	367.342	1266.134	904.387	2713.16

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:Why choose us?
A3:OEM/ODM/Designing service.