| Customization: | Available |
|---|---|
| After-sales Service: | Online Service |
| Warranty: | 12 Month |
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Semiconductor backend process, the wafer non contact splitting process equipment after wafer laser stealth dicing process.
Corresponding processing of 4''-12'' wafer products
Corresponding processing of blue tape, UV tape
Product features
Advanced non-contact splitting technology is applied.
Manual wafer loading and unloading
vision-assisted wafer position calibration
Bidirectional automatic wafer splitting
It is applicable to laser stealth dicing and knife dicing
| Item | GBW900 | |||
| Name | Semi automatic Wafer Splitting Equipment | |||
| Type | GBW908 | GBW914 | GBW912 | GBW920 |
| Wafer size | 8'' | 6''-8'' | 12'' | 8''-12'' |
| wafer type | Silicon Wafer | |||
| Wafer thickness | ≤250μm | |||
| Chip size | 0.1mm-0.25mm | |||
| Tape type | UV Tape | |||
| Ring type | 6‘’/8''/12'' Disco Standard Ring | |||
| Reserved thickness for dicing | 5-15μm | |||
| Capacity | 30/H | |||
| Power Consumption | AC 220v 8A | |||
| Electrostatic elimination | Ion wind rod | |||
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:Why choose us?
A3:OEM/ODM Designing.
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