Vacuum Thermal Co-Evaporation Deposition System

Product Details
Customization: Available
Feature 1: High Precision
Feature 2: High Efficiency
Diamond Member Since 2023

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  • Vacuum Thermal Co-Evaporation Deposition System
  • Vacuum Thermal Co-Evaporation Deposition System
  • Vacuum Thermal Co-Evaporation Deposition System
  • Vacuum Thermal Co-Evaporation Deposition System
  • Vacuum Thermal Co-Evaporation Deposition System
  • Vacuum Thermal Co-Evaporation Deposition System
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  • Overview
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

After-Sale Service
Provided
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

Features
•Achieve precise regulation of perovskite band gaps and dynamic control of nucleation and growth;
Realize the co-evaporation of wide/narrow bandgap perovskite. inorganic layers to facilitate the development of efficient tandem cells;
Integrated glove box, vacuum annealing furnace and other functional modules to meet custom requirements;
High-throughput carrier and mask design to enhance experimental throughput and cycle time.


Performance
 Item Value
 Substrate 300mm*300mm"3.2mm, downward compatible
 Number of co-evaporation sources 2-6
 Substrate temperature control Substrate temperature control
 Crucible volume 40cc
 Maintenance once/week
 Between/ithin uniformity <5%

Parameter
 Item Value
 Dimension 7250mm*5550mm*2400mm
 


Vacuum Thermal Co-Evaporation Deposition System

 
Exhibition & Customers

Vacuum Thermal Co-Evaporation Deposition SystemVacuum Thermal Co-Evaporation Deposition SystemJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

Vacuum Thermal Co-Evaporation Deposition System
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:Why choose us?
A3:OEM/ODM/Designing service.



 

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