Laser Ablation System

• Customization: Available
• After-sales Service: 1 Year
• Warranty: 1 Year
• Model NO.: HMLA-AF01
• Transport Package: Wooden Package
• Specification: 0*0*0
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

1. This laser system is used for laser ablation of the passivating films on the back of passivated emitter rear contact (PERC) solar cells. It supports online and offline production.
2. With compact spatial layout, the system features simple structure, convenient commissioning, standardized modular design, high compatibility and interchangeability.
3. The system provides multiple production modes, including two-laser, three-laser and four-laser production, realizing full coverage from low to high production capacity.
4. Composed of the host and the connection station, the system can realize manual loading and unloading as well as automatic AGV loading and unloading, satisfying customers' varying loading requirements.
5. It can be directly connected to any brand of printer, with high compatibility and flexibility.

• Designed with customized laser and special circuit, it incorporates smart manufacturing technologies.
• It adopts flexible graphic control modes, with multiple types of graphs, including points, lines, and dotted and solid lines.
• It realizes 15-50μm ultra-thin line width, non-destructive ablation, automatic microscale positioning, and automatic full-domain correction.

 

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

 

Field Application

 

 

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.