Wafer Loader Foup Fosb Device Manufacturer

• Customization: Available
• Application: Detector, Diode, Power Electronic Components, Temperature Measurement
• Batch Number: 2010+
• Certification: CE, RoHS
• Manufacturing Technology: Optoelectronic Semiconductor
• Material: Power Semiconductor
• Model: ST
• Package: BGA
• Signal Processing: Analog Digital Composite and Function
• Type: Intrinsic Semiconductor
• Product Name: Wafer Loader Foup Fosb Device Manufacturer
• Transport Package: Packed with Wooden Box by Sea Shipping
• Specification: 1200kg
• Trademark: Himalaya
• Origin: China
• Production Capacity: 5000

Product Description

Wafer loader FOUP FOSB device manufacturer

Product Features
• Standard support for FOUP and automatic door FOSB
• Unique door opening mechanism and precise motion control for high cleaning performance

Technical Specifications
• Wafer Specifications:8"~12"
• Carrier Type:12"FOUP FOSB,8"Open Casette
• Dimensions: 470X555X1340
• Cleaning: Class [email protected]μm
• Operation Time: With mapping; FOUP Open:19sec; FOUP Close:10sec
• Communication: RS232/RS485/Ethernet Port
• RFID (optional) RFID: TI 134kHz
• Power Supply: DC 24V 5A
• Negative Pressure: -50 ~ -80KPa
• Positive Pressure: 0.6~ -0.7MPa
• Weight: 70Kg