High Quality Auto-Positioning Sicwafer Cutting Machine with Warpage Wafer Transfer

• Customization: Available
• After-sales Service: Free Training
• Condition: New
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Driven Type: Electric
• Product Name: Wafer Laser Scribing / Cutting
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• OEM/ODM Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China
• Production Capacity: 50000

Product Description

High Quality Auto-Positioning Sicwafer Cutting Machine with Warpage Wafer Transfer
 

Product Description

Product Features

• Multiple laser operation modes and beam shaping, ensuring optimal incision quality and efficiency

• Correction technology ensures high precision machining and consistency

• Auto-positioning, auto-focusing, auto-detection, ensuring high yield rate

• Support warpage/TAIKO wafer transfer

 

Application

TAIKO ring cutting, Si/SiC
wafer cutting, Si/SiC wafer
Back metal cutting

Technical specification
Laser wavelength	355nm
Laser output power	15/30W
Processing method	Combined scanning and linear/rotary stage motion
Positioning accuracy	±1μm
Processing accuracy	±5μm
Wafer size	6 inch, 8 inch, 12 inch
Chipping	<10μm

 

 

 

Exhibition & Customers

Packaging & Shipping

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:Why choose us?
A3:OEM/ODM Designing.