High End Semiconductor Fully Automatic Laser Ring Cutting Machine

Product Description

Product Description

Introduction to the UV-CT Silicon Wafer UV Laser Cutting Machine

1. Product Overview

The UV-CT Silicon Wafer UV Laser Cutting Machine is a latest-generation high-end precision laser processing system developed by Dazu Laser Company in response to evolving customer requirements. It is purpose-built for high-precision dicing and slicing of silicon wafers and similar substrates.

The machine integrates a UV end-face pumped laser, a high-precision X-Y-θ workbench, and a CCD image processing system for alignment and real-time observation. Together, these deliver the high-speed, high-quality slicing performance demanded by modern semiconductor and hardware manufacturing.
 

 

 

2. System Architecture

The complete system comprises six core subsystems:

1. Laser and external optical path auxiliary adjustment system

2. Cooling system

3. Control system

4. Image recognition system

5. Motion system

6. Laser cutting software

The entire optical path is fully enclosed to prevent UV light leakage. The laser head offers a 0-10 mm lifting adjustment range, with a one-way travel time of 3-5 seconds. The workbench travel is scheduled at 300 × 100 mm, and custom strokes are available on request.

Workbench & Positioning

• Two-dimensional workbench plus a high-precision rotating workbench

• Positioning accuracy: ≤ ±5 μm

• Repeat positioning accuracy: ≤ ±3 μm

• Workpiece fixing: ceramic suction cups using negative pressure

• Positioning reference: outer circle of the workpiece

★ Note: Because positioning relies primarily on the workpiece outer circle, the coaxiality between the workpiece and its outer circle directly affects machining accuracy. Careful attention is required.
 

 

Working Steps

1. Ensure coaxiality of the feeding table and rotating table through physical adjustment (≤ 0.05 mm).

2. Place the workpiece into the positioning ring (diameter specified per requirements).

3. Fix the workpiece onto the workbench via ceramic suction cups and negative pressure.

4. Move the workbench to the designated position and fine-tune using the CCD image recognition system.

5. Turn on the laser and rotate the worktable for circular cutting.

6. After processing, move the workbench to the feeding position for unloading and reloading.

 

3. System Characteristics

• High-quality laser beam - single cutting seam width of 10-15 μm, single cutting depth ≥ 25 μm

  • Note: Thicker wafers require multiple cuts, which widens the seam depending on the number of passes.

• Reliable, high-precision X-Y-θ workbench

• CCD image processing system for real-time observation, with software that automatically performs parallel correction

• Efficient and flexible software operating system

 

4. Technical Parameters

 

 

Parameter	Specification
System Model	UVCS-10
Laser Type	UV
Workbench Stroke	100 mm × 100 mm × 360°
Resolution	X/Y: ±1 μm; θ: 1″
Positioning Accuracy	X/Y: ±5 μm; θ: ±15″
Flatness	±5 μm
Straightness	±5 μm
Encoder Resolution	1 μm
Single Cutting Seam Width	10-15 μm
Single Cutting Depth	≥ 25 μm
Cutting Speed	100 mm/s (varies by product)
Laser System Safety Level	Class 1

Environmental Requirements

 

 

Requirement	Specification
Power	220 V / single-phase / 50 Hz / 15 A
Temperature	20-25 °C
Humidity	20%-60%
Compressed Air	0.5 MPa, Φ8 mm interface
Vibration	Foundation amplitude < 5 μm; acceleration < 0.05 G
Whole Machine Weight	≈ 0.5 T
Dimensions (H×D×W)	1.55 × 0.9 × 0.8 m (1.2 m with display)
Chiller Dimensions	0.65 × 0.65 × 0.32 m

 

5. Basic Configuration

 

 

No.	Part Name	Model / Specification	Qty	Origin / Manufacturer
1	Industrial Computer	IPC	1	-
2	Monitor	15″ color display	1	Domestic
3	Chiller	HC500B-01B	1	-
4	Motion Control Card	Three-axis	1	Galil, USA
5	Main Control Box	DP-HR50L	1	-
6	Software	UV-CS	1	-
7	Lens	F = 25 mm	1	Imported
8	Voice Coil Motor	Stroke 10 mm	1	Customized
9	Beam Expander	-	1	Imported lens
10	Sound & Light Q-Head	QS	1	GOOCH, UK
11	Workbench	X, Y, Θ	1 set	Imported, Japan
12	CCD Camera	300,000 pixels	1 set	CORECO
13	Acquisition Card	PC2-VISION	1	CORECO
14	Laser Reflection & Output Lens Group	High-power, high-reflection, output laser lens	1	Imported

 
 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.