| Customization: | Available |
|---|---|
| After-sales Service: | Provided |
| Condition: | New |
Suppliers with verified business licenses
Audited Supplier Audited by an independent third-party inspection agency
Automatic recognition of front-end process marks. Direct access to Mapping files for laser marking
Line scan CCD detection and identification system
Material number processing information storage and recording function
| Technical specification | |
| Laser wavelength | 532nm |
| CCD positioning accuracy | ±5μm |
| Output power | 0-10W adjustable |
| Laser Marking Depth | 0.05-0.4mm adjustable |
| Line width | 30μm |
| Repeatability | ±3μm |
| CCD positioning | 5 megapixels |
| CCD video detection | 20 megapixels |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:Why choose us?
A3:OEM/ODM/Designing service.
){kind=link}