Fully Automatic Semiconductor Glue Coating and Developing Equipment

• Customization: Available
• After-sales Service: Provided
• Function: High Temperature Resistance
• Model NO.: Himalaya-27
• Demoulding: Automatic
• Condition: New
• Certification: RoHS, ISO, CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Desktop
• Driven Type: Electric
• Mould Life: >1,000,000 Shots
• Wafer Sizes Supported: 150mm, 200mm, 300mm
• Compatible Materials: Photoresist, Polyimide, Spin-on Dielec
• Viscosity Range: 15 to 50, 000 Cp
• Coating Thickness Range: 0.5 to 500 Micron
• Uniformity: ≤±1.5% (3σ)
• Defect Density: <0.1 Particles/Cm² (>0.2μm)
• <0.1 Particles/Cm² (>0.2μm): ±0.2°C (Across 7-Zone Hot Plate)
• Throughput: up to 200 Wph (200mm)
• Automation: Secs/Gem Compliance for Fab Integration
• Integration: Automated Wafer Handling
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Fully Automatic Semiconductor Glue Coating and Developing Equipment

Product Description

Advanced Semiconductor Coating Systems: Revolutionizing Wafer-Level Manufacturing Efficiency

Cutting-Edge Solutions for Next-Gen Chip Production

Himalaya's SCG series semiconductor coating equipment represents the pinnacle of wafer processing technology, delivering unmatched throughput and precision for 200mm and 300mm wafer fabrication. Our fully automated systems integrate seven critical semiconductor manufacturing processes into a single, space-saving platform.

.

Industry-Leading Performance Metrics

Model	WPH (200mm)	WPH (300mm)	Temperature Uniformity	Defect Rate
SCG-200	190	N/A	±0.2°C	<0.01%
SCG-300	110	85	±0.3°C	<0.015%

Core Technological Innovations

1. Intelligent Multi-Zone Thermal Control

Our patented 7-zone hot plate system (US Patent #US2023187654) features:

• PID-controlled heating elements with 0.1°C resolution
• Real-time thermal mapping via embedded IR sensors
• Adaptive recipe adjustment for different photoresist types

2. Precision Coating Technology

The nano-grade dispensing system achieves:

• ≤1.5μm coating uniformity (3σ)
• 15-50,000cP viscosity range handling
• AI-driven flow control reducing material waste by 18%

3. Space-Optimized Architecture

 

 

 

 

 

Wafer Loading-

Pre-Bake Module-

Coating Chamber-

Soft Bake Cluster-

Alignment Station-

Exposure Interface

It can be paired with 8 process chambers and 24 baking units (AD units and WEE units can be configured),
By using three robots to transport the upper and lower chips of the wafer, it can be connected to the lithography machine (inline) for front processing
Road 4-6 inch wafers with a technology node of 180 nanometers or higher. It combines user-friendly operation and functionality
The flexible configuration of art supports widespread application in mass production.
1. The three-dimensional intersection structure, combined with software algorithms, improves equipment production capacity.
2. The shared arm structure reduces the occupied space and improves process consistency.
3. Adopting high-precision metering photoresist pump and multi-stage suction valve to save adhesive amount and avoid pollution.
4. Independently developed high-precision hot plate with 7-zone control, using power control.
5. The robotic arm comes with a positioning function to improve efficiency and stability.
6. Supports mainstream lithography machine interfaces.

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
 

Q3:Why choose us?
A3:OEM/ODM/Designing service.