| Customization: | Available |
|---|---|
| After-sales Service: | Provide |
| Condition: | New |
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| Product features | small window opening |
| Maximum substrate size | 610mm×630mm |
| Minimum substrate size | 250mm×250mm (single machine), 400mm×400mm (automatic line) |
| Substrate thickness | 0.1mm~3mm |
| Process analysis (bridge/window opening) | 35μm/50μm |
| Line width uniformity | ±10% |
| Depth of field | ±100μm |
| DMD splicing | ≤3μm |
| Outer alignment accuracy | ±6μm |
| Energy uniformity | ≥95% |
| Undercut | When the ink thickness is 25μm, the undercut value is less than 10μm |
| Ink color | green/black |
| Exposure time (623mm×515mm & four-point orientation, excluding upper and lower plates) | 46 seconds/face @500mj/cm² |
| Production efficiency (623mm×515mm & four-point pair) | 1.3 side/min @500mj/cm² |
| Number of single-machine countertops | single countertops |
| Weight of stand-alone equipment | 5500kg |
| Stand-alone dimensions | 2940mm×1700mm×2195mm |
| Automatic wire size | 6380mm×082mm×2455mm (excluding plate receivation machine) |
| Working height (transmission height) | 890±20mm |
| Product features | production capacity is preferred |
| Maximum substrate size | 623mm×730mm |
| Minimum substrate size | 250mm×250mm (single machine), 400mm×400mm (automatic line) |
| Substrate thickness | 0.1mm~3mm |
| Process analysis (bridge/window) | 40μm/60μm |
| Line width uniformity | ±10% |
| Depth of field | ±100μm |
| DMD splicing | ≤3μm |
| Outer alignment accuracy | ±6μm |
| Energy uniformity | ≥95% |
| Undercut | When the ink thickness is 25μm, the undercut value is less than 10μm |
| Ink color | green/black |
| Exposure time (623mm×515mm & four-point opposite position, excluding upper and lower boards) | 20 seconds/face @500mj/cm² |
| Production efficiency (623mm×515mm & four-point orientation) | 2.5 face/min @500mj/cm² |
| Number of single-machine countertops | single countertops |
| Weight of stand-alone equipment | 5500kg |
| Stand-alone dimensions | 2940mm×1700mm×2195mm |
| Automatic wire size | 6380mm×3082mm×2455mm (excluding plate receivation machine) |
| Working height (transmission height) | 890±20mm |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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