Fully automatic Clip Bonder machine manufacturer die bonding equipment
The fully automatic Clip Bonder equipment is developed, designed, produced and sold by Himalaya Semiconductor Technology Co., Ltd. The equipment is suitable for most clip product packaging and is quite practical. The biggest advantage is that the welding head is a high-precision linear welding head. The high precision of the crystal bonding, fast speed and stable quality are the highlights of this equipment. There are two options for the sintering furnace: vacuum and flat furnace.
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Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:Why choose us ?
A3:OEM/ODM/Designing.
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