Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms

• Customization: Available
• After-sales Service: Provided
• Function: Laser Grooving
• Model NO.: Himalaya-6688-4
• Demoulding: No
• Condition: New
• Certification: RoHS, ISO, CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Driven Type: Electric
• Mould Life: Laser Warranty for One Year
• Product Name: Laser Grooving Machine
• Feature 1: High Precision
• Feature 2: High Efficiency
• Height Difference: 52.655 μm
• Largest Angle: 35.563°
• Highest Cross-Section Area: 2503.567 μm²
• Horizontal Distances: 60–75 μm Across Segments
• Most Segments Show Minimal Tilt: Angles <5°
• Line Type: Two-Point Definition
• Step Height: 138.167 μm
• Transport Package: Customized or Wooden Box Packaging
• Specification: 1400 x2400x 2440 (including tricolor light)
• Trademark: Himalaya
• Origin: China

Product Description

Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms
 

This machine is a specialized equipment for semiconductor wafer Laser Grooving, designed as a fully automatic model, and adopts a plug type (customized special) material box feeding method. The equipment integrates high-performance, high-power, and ultra fast lasers, providing long-term stable and high-quality laser output performance. It is equipped with high-precision robotic arms and motion platforms to ensure accurate processing.

Segment	Horizontal Distance (um)	Height Difference (um)	Height Average (um)	Angle (Deg)	Cross-Section Length (um)	Cross-Section Area (um2)	R Value
All	510.713	0.949	48.089	0.106	618.489	24576.14	N/A
Segment 1	75.024	1.492	12.328	1.14	152.529	927.494	24576.14...
Segment 2	59.881	1.715	6.09	1.14	65.614	367.342	(not specified)
Segment 3	63.57	52.655	33.887	35.563	89.425	2503.567	2503.567...
Segment 4	72.145	4.389	12.255	3.49	72.371	510.445	(not specified)
Segment 5	66.633	3.403	8.967	2.923	66.87	413.648	(not specified)
Segment 6	72.459	3.068	12.357	2.422	72.636	498.345	(not specified)

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:Why choose us?
A3:OEM/ODM/Designing service.