High Power Ceramic Laser Cutting and Punching Machine

Product Details
Customization: Available
After-sales Service: 1 Year
Warranty: 1 Year
Diamond Member Since 2023

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  • High Power Ceramic Laser Cutting and Punching Machine
  • High Power Ceramic Laser Cutting and Punching Machine
  • High Power Ceramic Laser Cutting and Punching Machine
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  • Product Description
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  • After Sales Service
Overview

Basic Info.

Model NO.
HMLA-CERA02
Laser Wavelength
1060-1080nm
Laser Output Power
1000W
Max.Cutting Range
600*600mm
Transport Package
Wooden Case
Specification
0*0*0
Trademark
none
Origin
China

Product Description

Product Description
 
  • This model adopts the most advanced semiconductor fiber laser in the world. The beam quality is good, the volume is small, and the photoelectric conversion efficiency is high. Long term use, maintenance free, low cost, low power consumption and other advantages.

 
High Power Ceramic Laser Cutting and Punching Machine

Advantage

1. This model adopts the most advanced semiconductor fiber laser in the world. The beam quality is good, the volume is small, and the photoelectric conversion efficiency is high. Long term use, maintenance free, low cost, low power consumption and other advantages;

2. It adopts marble precision platform and gantry integrated closed structure, which has good rigidity, shock resistance and high-speed stability;

3. It adopts magnetic suspension imported linear motor, 0.5um high-precision grating ruler and full closed-loop bus CNC system, which has high response speed, high precision and low maintenance rate;

4. It is mainly used for laser cutting and drilling of AL2O3,ZrO2, AIN, SI3N4 and other advanced precision ceramics;

5. With CCD vision positioning system, it can also be used for cutting and marking of metallized ceramics and chip substrate.

Applications

  • Industrial products: various industrial ceramic products and molds
  • Machinery industry: ceramic machinery parts and components
  • 3C industry: various ceramic substrates, mobile phone ceramic backboard, middle frame, wearing digital products, etc
  • New energy industry: ceramic devices such as solar photovoltaic equipment, automotive sensors, hydrogen fuel cells, etc.

Technical Parameters

NO

  PROJECT

SPECIFICATIONS  

1

Laser wavelength

1060-1080nm

2

Laser output power

1000W CUSTOMIZATION

3

Max.cutting range

 600*600mm

4

Cutting thickness

0.2-8mm(Depending on material)

5

Precision of repeated positioning of X/Y axis

±5um

6

Processing speed

0-3000mm/min

7

Maximum distance speed

60m/min

8

 Maximum acceleration

1.0G

9

Worktable precision

<=0.015mm

10

 Transmission mode

Imported linear motor +0.5um linear encoder Imported linear motor +0.5um grating ruler

11

Whole machine power (no fan)

<=7KW

12

Total weight of the whole machine

(about)1800KG

13

External dimension(length*width*height)   

1800*1470*1890mm

(in kind prevail)



Sample

High Power Ceramic Laser Cutting and Punching Machine
 
Company

 

High Power Ceramic Laser Cutting and Punching Machine
Our Partner

 

High Power Ceramic Laser Cutting and Punching Machine
Packaging & Shipping

 

High Power Ceramic Laser Cutting and Punching Machine
After Sales Service

 

High Power Ceramic Laser Cutting and Punching Machine

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