| Customization: | Available |
|---|---|
| After-sales Service: | Provide |
| Function: | High Temperature Resistance |
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Hot air circulation rubber discharge furnace (degreasing furnace)
The hot air circulation dispensing furnace is specifically designed for the dispensing process of ceramics using various molding methods, such as ceramic inserts, ceramic phone shells, MLCC, etc. It can achieve the rubber discharge and secondary purification treatment of waste gas in the product, and can realize the rubber discharge process,
characteristic:
1. Working temperature RT-550 ° C
2. The hot air circulation structure has a uniform temperature field and adjustable wind speed,
3.6 thermocouple layout monitoring, 1 temperature control and 5 temperature measurement, temperature recorder online display and recording,
5. 0.1 level precision program temperature controller for temperature control, PID parameter self-tuning, over temperature, under temperature, and broken coupling alarm protection
6. The furnace and material trays are all made of alloy heat-resistant plates, which are resistant to high temperature and corrosion, and have a high level of cleanliness inside the furnace.
7. Complete protection functions, degreasing and explosion-proof system, over temperature protection function, automatic power off when over temperature occurs.
8. The furnace door adopts a double-layer convex concave sealing structure, which prevents heat from leaking out.
9. Additional optional: exhaust gas treatment secondary purification device.
| Feature | Application | Key Technical Advantages |
|---|---|---|
| 1. Thick Film Circuits | Adhesive discharge sintering for ceramic substrate printing (e.g., hybrid circuits, sensors). | - Precise temperature control (±1°C) avoids warping |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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