| Customization: | Available |
|---|---|
| After-sales Service: | Yes |
| Function: | Abrasion Resistance, High Temperature Resistance |
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ADW3000 seriesde-taping machine isapplicable to the de-taping process after wafer thinning. Advanced de-taping technology is applied, which can be compatible with adhesive tape and hot melt tape. 8''-12'' is available to handel. Taiko and Non-taiko wafers can be processed. It is applicable to tape peeling technoloy of wafers after thinning of 8''-12''
Product Features
Dual-purpose machine, capable of fully automatic de-lamination as well as full UV de-bonding
Employs adanced anti-static rollers and constant temperature hot-melt taple lamination technology
Automatic tape conveyance and application
Suitable for various wafer types includint conventional, ultra-thin and Taiko
Automatic wafer detection, edge scanning, and transportation
Automatic UV or thermal curing de-bonding
A variety of wafer handling technologies available, including vacuum, Bernoulli, and gripper systems
SECS/GEM or basic networking capabilities
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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