Full-Automatic Wafer De-Taping Equipment

Product Details
Customization: Available
After-sales Service: Yes
Function: Abrasion Resistance, High Temperature Resistance
Diamond Member Since 2023

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  • Full-Automatic Wafer De-Taping Equipment
  • Full-Automatic Wafer De-Taping Equipment
  • Full-Automatic Wafer De-Taping Equipment
  • Full-Automatic Wafer De-Taping Equipment
  • Full-Automatic Wafer De-Taping Equipment
  • Full-Automatic Wafer De-Taping Equipment
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  • Overview
  • Product Description
  • Product Parameters
  • Field Application
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Model NO.
ADW3000
Condition
New
Warranty
12 Months
Automatic Grade
Automatic
Installation
Vertical
Driven Type
Electric
Mould Life
300,000-1,000,000 Shots
Control System
PC+PLC
Transport Package
Wooden Package
Specification
100Kg
Trademark
Himalaya
Origin
China
HS Code
8541590000
Production Capacity
500

Product Description

Product Description

ADW3000 seriesde-taping machine isapplicable to the de-taping process after wafer thinning. Advanced de-taping technology is applied, which can be compatible with adhesive tape and hot melt tape. 8''-12'' is available to handel.  Taiko and Non-taiko wafers can be processed. It is applicable to tape peeling technoloy of wafers after thinning of 8''-12''

Product Features
Dual-purpose machine, capable of fully automatic de-lamination as well as full UV de-bonding
Employs adanced anti-static rollers and constant temperature hot-melt taple lamination technology
Automatic tape conveyance and application
Suitable for various wafer types includint conventional, ultra-thin and Taiko
Automatic wafer detection, edge scanning, and transportation
Automatic UV or thermal curing de-bonding
A variety of wafer handling technologies available, including vacuum, Bernoulli, and gripper systems
SECS/GEM or basic networking capabilities

Product Parameters

 

Full-Automatic Wafer De-Taping Equipment
Field Application

Full-Automatic Wafer De-Taping EquipmentFull-Automatic Wafer De-Taping Equipment

Exhibition & Customers

Full-Automatic Wafer De-Taping EquipmentFull-Automatic Wafer De-Taping Equipment

Packaging & Shipping

Full-Automatic Wafer De-Taping EquipmentFull-Automatic Wafer De-Taping Equipment

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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