Jiangsu, China
Main Products:
Year of Establishment:
2019-09-12
Repeat Buyers Choice:
80%~100%
Address:
Room 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital:
100,000,000 RMB
Main Markets:
Europe
Die Bonder, Wire Bonding manufacturer / supplier in China, offering Wafer Thickness, Line Mark, and Ttv Detection in Silicon Wafer Manufacturing, Quartz and Graphite Boat Position Detection with Laser Displacement Sensor, Wafer Edge Detection in Hjt Cells with Sincevision 3D Laser Profiler and so on.
Diamond Member
Audited Supplier
