High Quqlity Auto-Positioning Si/Sicwafer Cutting Machine with Warpage/Taiko Wafer Transfer

• Customization: Available
• After-sales Service: Online Service
• Condition: New
• Speed: High Speed
• Precision: High Precision
• Warranty: 12 Months
• Automatic Grade: Automatic
• Type: High-speed Chip Mounter
• Laser Output Power: 15/30W Combined Scanning and Linear/Rotary Stage M
• Laser Wavelength: 355nm
• Transport Package: Air Freight
• Trademark: Himalaya
• Origin: China
• Production Capacity: 50000

Product Description

High Quqlity Auto-Positioning Si/Sicwafer Cutting Machine with Warpage/Taiko Wafer Transfer

Product Description

The HR series is a new generation of mobile robots mainly used for indoor logistics operations.

Mobile robots can autonomously transport materials and navigate, reducing the workload of workers,
Improved enterprise efficiency. It adopts dual LiDAR navigation, 360 degree safe obstacle avoidance, and can
With safe and uninterrupted operation, and equipped with a scheduling control system, it can achieve multiple
The trolley works simultaneously to ensure that production tasks are always running and maintain flexibility in handling.

Detailed Photos

Collaborating robotic arm, mobile chassis, vision, independently developed STAR composite robot
Intelligent operation of gripper and other components to achieve material grasping, handling, assembly, and inspection
Application of testing and other functions, and the ability to match corresponding scheduling systems according to the customer's on-site usage environment,
Integrate with customer MES and other systems for flexible scheduling and rapid deployment.
Mainly used in industry (such as 3C
Metal products, automotive parts
Electricity, new energy, ships
Aerospace, medical and health care
Birth, Family Services, Data Management
Management and other industries.

Technical specification
Laser wavelength	355nm
Laser output power	15/30W
Processing method	Combined scanning and linear/rotary stage motion
Positioning accuracy	±1μm
Processing accuracy	±5μm
Wafer size	6 inch, 8 inch, 12 inch
Chipping	<10μm

 

Exhibition & Customers

Field Application

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:Why choose us?
A3:OEM/ODM Designing.