| Customization: | Available |
|---|---|
| After-sales Service: | 7*24 Hours |
| Function: | High Temperature Resistance |
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This single machine plastic sealing equipment is a compact, high-performance solution for semiconductor packaging processes. Designed for manual operation with advanced automation features, it provides reliable molding capabilities for various lead frame and substrate specifications.
Key Features and Capabilities:
Precision Molding Performance: The equipment delivers robust molding force with mold closing pressure of 98-1176 kN and precise injection pressure of 1-29.4 kN, ensuring consistent packaging quality for lead frames/substrates ranging from 20-90mm width, 124-300mm length, and 0.15-1.2mm thickness.
Material Compatibility and Control: Compatible with plastic sealing materials of diameter φ11-φ20mm (±0.2mm) and aspect ratio of 1.2-2.0 (maximum 35mm). The system features advanced PLC control (Omron) with pressure curve monitoring and storage, operated through a user-friendly 7-inch touch screen interface.
Comprehensive Safety and Optional Features: Equipped with multiple safety protections including safety grating, leakage protection, emergency stop buttons, and sensor-protected doors. Optional mold vacuum system and isolation film system are available for specialized process requirements.
Space-Efficient Design: Compact footprint (1340×1775×2100mm) with weight of 2 tons, suitable for cleanroom environments requiring 100,000 class cleanliness, temperature control of 22-28°C, and humidity range of 50%-75%.
| Single Machine Plastic Sealing Equipment Specifications | ||
| Category | Parameter | Specification |
| Main Technical Parameters | Mold Closing Pressure | 98-1176 kN |
| Injection Pressure | 1-29.4 kN | |
| Lead Frame/Substrate Size (W×L×Thickness) | 20-90 mm × 124-300 mm × 0.15-1.2 mm | |
| Molding Compound Specifications | Diameter: φ11-φ20mm (±0.2mm); Aspect Ratio (L/D): 1.2-2.0 (Max 35mm) | |
| Control System | PLC (Omron); Pressure curve output and storage | |
| Operating System | 7-inch touch screen | |
| Loading/Unloading Method | Manual | |
| Optional Systems | Mold vacuum system; Isolation film system | |
| Safety Protection | Safety grating, leakage protection, emergency stop, safety sensor with fully protected door | |
| Physical Dimensions & Weight | Equipment Dimensions (L×W×H) | 1340 × 1775 × 2100 mm |
| Dimensions with Door Open (L×W×H) | 1810 × 3300 × 2100 mm | |
| Equipment Weight | 2 tons | |
| Environmental Requirements | Temperature Range | 22-28°C |
| Humidity Range | 50%-75% | |
| Cleanroom Grade | 100,000 level | |
| Foundation Requirements | 2 tons/square meter | |
| Utility Connections | Power Supply | AC 380V, 50/60Hz, 11 kW |
| Cable Specification | 6 mm² | |
| UPS Requirement | Required | |
| Compressed Air Pressure | 6 kgf/cm² | |
| Compressed Air Connection | 6 mm | |
| Compressed Air Flow Rate | 1 m³/h | |
| Special Gases | Hydrogen, Gaseous Nitrogen | |
| Cooling System | Not required | |
| Exhaust Requirement | 100 mm ventilation pipe | |
| Additional Features | Display System | Equipment display included |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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