High Precision Laser Ceramic Cutting Machine

• Customization: Available
• Feature 1: High Precision
• Feature 2: High Efficiency
• Model NO.: HIMA-8012
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

1.Introduction
The HIMA-8012 ceramic cutter is specifically designed for high-speed and high-precision cutting of multilayer ceramic capacitors (MLCC), chip inductors, multilayer ceramic modules, and package casings. The cutting blade and carrier stage can be heated independently, with program-controlled preheating to achieve variable-depth cutting on green ceramic substrates. Through its enhanced software and direct-drive motion system, the program automatically (retrieves) cutting positions, alignment coordinates, camera parameters, blade speed, and cutting depth, while memorizing start/end positions for fully automated cutting.
2.Key Functions
(1) Industrial Computer & Display System:
Equipped with an industrial-grade computer to control all system operations, perform real-time diagnostics, and monitor equipment status. Features a 17-inch LCD monitor, keyboard, and mouse.
(2) Dedicated Process Software:
The PTC Pro-Cut operational software enables arbitrary editing and configuration of cutting parameters (within specified ranges), with alarm and fault prompt functions. Capable of saving all process programs and supporting metric/imperial unit switching.
(3)Operation Modes:
Manual operation and CCD auto-alignment.
(4)5-Axis Programmable Motion Control System:
The Y, Z, and θ axes are each driven by high-precision servo motors with encoders, while left/right CCD cameras are controlled by stepper motors. Coordinated motion allows precise adjustment of errors detected by the vision mark recognition system.
(5) 8" Cutting Tool System:
Comprises a blade holder, cutting separator, and blade heater. The holder ensures stable blade positioning, while the separator provides guidance and protection with adjustable spring pressure and manual height adjustment.
(6) 8" Standard Vacuum Cutting Stage:
Integrated vacuum generator with evenly distributed micro-vacuum pores to securely fix workpieces during cutting, preventing displacement.
(7) Blade & Stage Temperature Control:
Two independent PID temperature controllers precisely regulate blade and stage temperatures.
(8)CCD Alignment System:
Dual CCD cameras with video capture cards and image dividers. Adjustable-position cameras enable precise alignment of surface/side cutting marks via translational and rotational stage movements. Features LED lighting with adjustable brightness, position, and angle.
(9)Image Recognition:
Crosshair centering alignment. Capable of identifying Mark labels in colors with high contrast (e.g., black, gold, silver).
(10) Process Data Logging
Records processing information (cutting count, blade life cycle settings/alerts, operation authority management) with editable functions.
(11) Fault Diagnosis System:
Real-time monitoring of machine status and program execution. Alerts for critical issues (e.g., motion tolerance deviations, timeouts, vision system failures).
3.Technical Specifications
(1) Stage Movement Range:
Y-axis: 300mm
Z-axis: 30mm
Rotation angle: 150°
(2)Motor Resolution:
Y/Z-axis: ±0.0025mm
θ-axis: ±0.00035°
(3)Alignment Accuracy:
Y/Z-axis: ±0.005mm
θ-axis: ±0.001°
(4)Blade Dimensions:
Thickness (T): 0.1mm~0.4mm
Height (H): 22.4mm
Length (L): 203mm
(5)Temperature Control:
Blade/stage temperature range: RT~100°C
Uniformity: ±3°C
(6) Max. Cutting Thickness: 6mm (product-dependent)
(7)Cutting Size Range:100mm~203mm
(8) Repeat Positioning Accuracy:±0.005mm
(9) Z-axis max. speed: 500mm/s
Max. throughput: 6 cuts/sec
(10)Vision System: Dual CCD with crosshair centering
(11)Control System: Industrial computer with 17" LCD
(12)Operating System:Windows 10
(13) Operation mode: manual and CCD automatic camera alignment
(14) Light Source: Adjustable-brightness LED

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:Why choose us?
A3:OEM/ODM/Designing service.