Topcon Cell De-Plating & RCA Cleaning Equipment

Product Details
Customization: Available
Feature 1: High Precision
Feature 2: High Efficiency
Diamond Member Since 2023

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  • Topcon Cell De-Plating & RCA Cleaning Equipment
  • Topcon Cell De-Plating & RCA Cleaning Equipment
  • Topcon Cell De-Plating & RCA Cleaning Equipment
  • Topcon Cell De-Plating & RCA Cleaning Equipment
  • Topcon Cell De-Plating & RCA Cleaning Equipment
  • Topcon Cell De-Plating & RCA Cleaning Equipment
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  • Overview
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

After-Sale Service
Provided
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

Features
• High-capacity equipment, capable of processing 6 baskets at a time;
• Distributed coil &V type runner plate forms a high-efficiency liquid distribution system;
• Self-compensating dynamic balancing exhaust system;
• Arm dispatch system, Achieve flexible production;
• Uses infrared heating system to heat water ; no metal ion
precipitation ;
• Combining efficient fltration with preliminary filtration, ensure
higher cleanliness inside the device;
• High speed and stable manipulator system, load100kg.


Performance
Item Value
Productivity 16000pcs/h(116 whole pieces per basket, 6 baskets/slots)
Breakage rate <0.3%(Wafer thickness >110um)
Uptime 95%
Product yield >99.9%

Parameter
Item Value
Cleaning process Alkline→PreCIn→HF→Post1→DHF→DRY
 


Topcon Cell De-Plating &amp; RCA Cleaning Equipment

 
Exhibition & Customers

Topcon Cell De-Plating &amp; RCA Cleaning EquipmentTopcon Cell De-Plating &amp; RCA Cleaning EquipmentJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

Topcon Cell De-Plating &amp; RCA Cleaning Equipment
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:Why choose us?
A3:OEM/ODM/Designing service.



 

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