High End Semiconductor Fully Automatic Llo Laser Peeling Machine

Product Details
Customization: Available
After-sales Service: Online Service
Function: High Temperature Resistance
Diamond Member Since 2023

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  • High End Semiconductor Fully Automatic Llo Laser Peeling Machine
  • High End Semiconductor Fully Automatic Llo Laser Peeling Machine
  • High End Semiconductor Fully Automatic Llo Laser Peeling Machine
  • High End Semiconductor Fully Automatic Llo Laser Peeling Machine
  • High End Semiconductor Fully Automatic Llo Laser Peeling Machine
  • High End Semiconductor Fully Automatic Llo Laser Peeling Machine
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  • Overview
  • Product Description
  • FAQ
Overview

Basic Info.

Demoulding
Automatic
Condition
Used
Certification
ISO
Warranty
12 Months
Automatic Grade
Automatic
Installation
Desktop
Driven Type
Electric
Mould Life
>1,000,000 Shots
Accuracy
± 15 Um
Power Requirements
Three-Phase 380V
Transport Package
Packed with Wooden Box
Specification
Standard Specifications
Trademark
Himalaya
Origin
China
Production Capacity
50000

Product Description

High End Semiconductor Fully Automatic Llo Laser Peeling Machine
Product Description

Using pulsed laser radiation with photon energy greater than GaN bandgap and smaller than sapphire bandgap to irradiate sapphire substrate, GaN is thermally decomposed into nitrogen gas and low melting point metal Ga (only 30 ºC) in a stable range of 900 ºC -1000 ºC, achieving the separation of GaN epitaxial layer and sapphire substrate.

High End Semiconductor Fully Automatic Llo Laser Peeling MachineLaser exfoliation technology utilizes laser energy to decompose the GaN buffer layer at the GaN/sapphire interface, thereby achieving the separation of LED epitaxial wafers from sapphire substrates. This device uses a DPSS laser and is specifically designed with an external optical path for wafer peeling, which can achieve efficient and high-quality peeling effects.
High End Semiconductor Fully Automatic Llo Laser Peeling MachineUsing DPSS solid-state laser
Processable products: flat sheets, PSS, PSS+PVD
Fully automatic loading and unloading of 4-inch and 6-inch pieces for production, with the ability to manually feed 2-inch pieces for production
Stripping low damage, high yield, can work continuously for 24 hours, stable performance, and low operating costs
Process parameters are adjustable and storable
With log documents, in conjunction with the customer's SECS, processing parameters and processes can be uploaded and saved
The carrier can be lifted and lowered, and the focus can be adjusted through regional lifting compensation, which can solve the problem of chip warping
Metal trays are installed around the processing platform to prevent debris from falling into the interior of the equipment
Laser power automatic monitoring to ensure peeling effect
The equipment is equipped with EFU to ensure internal cleanliness of the machine
1. Fully automatic loading and unloading of 4-inch and 6-inch pieces within the processing range, with the ability to manually feed 2-inch pieces for production
2 lasers and optical path UV lasers, with a maximum processing power of ≥ 1W
3-platform Y-axis
Travel: 400mm
Repetitive positioning accuracy: ± 1um
4-platform X-axis
Travel: 350mm
Repetitive positioning accuracy: ± 1um
5-stage lifting W-axis lifting stroke: > 5mm
6. Full automatic loading and unloading mechanism
7 galvanometer and control system 1. Maximum speed: 5000mm/s
2. Accuracy: ± 15 um
8 Processing method 1. Spiral from outside to inside
2. Linear filling method
9 Laser processing efficiency 4 inch flat sheet: 240s/sheet (excluding loading and unloading)
(The time for single peeling may vary greatly depending on the product)
10 peeling efficiency 4 inches flat film: 8870 pieces/month (calculated at 22 hours/day, 28 days/month)
11 peel yield, appearance yield ≥ 98%, 4 inch flat film
12. Equipment utilization rate ≥ 95%
1. Power requirements: three-phase 380V ± 10%, 50/60Hz, 25A (max). Places to avoid
2. Environmental temperature and humidity of 21-23 ºC, with a temperature change of ± 1 ºC; RH40~70%, in places with no condensation, garbage, dust, or oil mist;
Places with high vibrations and impacts;
Places that can reach drugs and flammable and explosive materials;
Places near high-frequency interference sources;
Places where temperature changes rapidly;
In environments with high concentrations of CO2, NOX, SOX, etc.
3 Cleanliness level 1000
4 CDA pressure: > 0.5MPa; Flow rate: 250L/min; Pipe diameter: φ 12mm
5. The cooling water chiller uses ordinary bottled purified water and is replaced once a month
6. Compressed nitrogen N2 above 0.5MPa, purity ≥ 99.99%; Pipe diameter: φ 6mm
7. General exhaust pipe diameter: φ 100mm; Flow rate: 3CMM
8 Environmental vibration requirements: Foundation amplitude<5 μ M; Vibration acceleration<0.05G
High End Semiconductor Fully Automatic Llo Laser Peeling Machine1: 4 inch sample PSS substrate silicon wafer transfer layer
High End Semiconductor Fully Automatic Llo Laser Peeling MachineHigh End Semiconductor Fully Automatic Llo Laser Peeling Machine2: 4 inch sample PSS+AlN substrate silicon wafer transfer layer
High End Semiconductor Fully Automatic Llo Laser Peeling MachineHigh End Semiconductor Fully Automatic Llo Laser Peeling Machine3: 2 inch sample flat substrate silicon wafer transfer layer
High End Semiconductor Fully Automatic Llo Laser Peeling MachineHigh End Semiconductor Fully Automatic Llo Laser Peeling MachineLaser processing marks and local enlarged images
High End Semiconductor Fully Automatic Llo Laser Peeling MachineHigh End Semiconductor Fully Automatic Llo Laser Peeling MachineHigh End Semiconductor Fully Automatic Llo Laser Peeling MachineHigh End Semiconductor Fully Automatic Llo Laser Peeling Machine
High End Semiconductor Fully Automatic Llo Laser Peeling Machine
High End Semiconductor Fully Automatic Llo Laser Peeling Machine
 
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:Why choose us?
A3:OEM/ODM Designing.

 

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