| Customization: | Available |
|---|---|
| Certification: | ISO9001 |
| Protection: | Shock Resistance |
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niform thickness in silicon wafers is critical for photovoltaic manufacturing, ensuring optimal performance and reducing waste. Even minor inconsistencies in thickness can affect production quality and increase costs, making reliable thickness detection a necessity.
SinceVision's SG5025 Laser Displacement Sensor offers precise and stable measurements of silicon wafer thickness. Using a dual-sensor through-beam method, each side of the wafer is independently measured, combining the data for a final thickness reading accurate to 5μm. This setup enables real-time monitoring and ensures consistent production standards.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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