Best Wire Bonding Machine for LED Chip Packaging – Anti-Vibration Design

• Customization: Available
• After-sales Service: 1 Year Warranty
• Function: Abrasion Resistance, High Temperature Resistance, Anti-Corrosion
• Model NO.: HMLY-WB-02
• Demoulding: Pull Core
• Condition: New
• Certification: CCC, PSE, FDA, RoHS, ISO, CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Driven Type: Electric
• Mould Life: >1,000,000 Shots
• Online Technical Guidance: Once Every Month
• Visit The Production and Use of Customer: 2-4 Times/Year
• Invite Customer Technical Personnel to S: 2 Opportunities Per Year
• Introduction of Domestic Advanced Techno: Every Year, We Will Share The Technical Updates of
• Installations: Vertical
• Model Number: H580plus
• Precision & Speed: 45ms/Line Bonding Cycle
• Linear Table: Linear Motor-Driven Xy Table
• Linear Table Size: 56mm × 80mm
• Transport Package: International Trade Standard
• Specification: 985mm*960mm*1770mm
• Trademark: Himalaya
• Origin: China
• HS Code: 8486402200

Product Description

Product Description

Discover the H580PLUS High-Speed Fully Automatic Wire Bonder, designed for semiconductor packaging.

Wire Bonding Machine Features

Ultra-High Precision & Speed

Advanced Vision & Control

1. 45ms/line bonding cycle with ±3μm repeatability (3σ) for ICs like BGA, QFP, COB, and optocouplers.

2. Linear motor-driven XY table (56mm × 80mm area) ensures rapid, accurate positioning.

1. New zoom lens with wider FOV and clearer imaging for complex wire patterns.

2. Servo system enhances UPH (Units Per Hour) with real-time force calibration and intelligent bonding force alerts.

Specification

Feature/Specification	Detail
Model Number	H580PLUS
Condition	New
Certifications	CCC, PSE, FDA, RoHS, ISO, CE
Warranty	12 Months
Automatic Grade	Automatic
Installation	Vertical
Driven Type	Pneumatic
Mould Life	>1,000,000 Shots
Online Technical Guidance	Once Every Month
Customer Production/Use Visits	2-4 Times/Year
Customer Technical Personnel Invitations	2 Per Year (S2 Opportunities)
Introduction of Domestic Advanced Technology/Updates	Every Year
Transport Package	International Trade Standard
Specification (Dimensions)	985mm * 960mm * 1770mm
Trademark	Himalaya
Origin	China
HS Code	8486402200

Packing & Delivery

Packaging
Wooden Crate (IPPC Certified)Heavy-duty plywood/wooden case with fumigation compliance (ISPM-15 standard).
Shock-absorbent cushioning (foam, airbags) to protect sensitive components.
Weatherproof & tamper-proof sealing for international shipping.

Freight Options
Air Freight (Recommended for Urgent Shipments)
Best For: High-value, low-volume shipments (e.g., single machines).

Sea Freight (Cost-Effective for Bulk Shipments)
Best For: Full-container-load (FCL) or less-than-container-load (LCL) shipments.

Considerations: Requires customs clearance & inland logistics coordination.

Railway Freight (Land-Based Alternative)

Delivery for cross-continent shipments, e.g., China-Europe rail.
Best For: Heavy equipment moving between inland industrial hubs.
Considerations: More eco-friendly than air but slower than express shipping.

Company Profile

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu Himalaya Semiconductor Co., Ltd. is a premier semiconductor equipment manufacturer and global exporter established in 2019. We specialize in providing high-performance, cost-effective semiconductor manufacturing solutions to clients worldwide, with a strong presence in 30+ countries and a network of 200+ satisfied customers and suppliers.

Our mission is to deliver the highest value at the final procurement stage, ensuring:
Cost Efficiency – Competitive pricing without compromising quality Risk-Free Transactions – Secure one-time payment solutions for suppliersReliable Integration – End-to-end equipment and technical support

FAQ

1. What is Wire Bonding?
Wire bonding is a solid-phase welding process that creates electrical interconnections between an IC chip and its substrate/package using fine wires (Au, Cu, or Al). It's the most common interconnection method in semiconductor packaging.

 
2. What are the Main Types of Wire Bonding?
Ball Bonding (Gold/Copper):

Uses thermosonic (heat + ultrasound) bonding.
Forms a spherical 1st bond (on chip) and wedge 2nd bond (on substrate).
Applications: High-speed ICs, CPUs, memory.
Wedge Bonding (Aluminum/Gold):

Ultrasonic-only bonding (no heat).
Both bonds are wedge-shaped.
Applications: Power devices, RF, sensitive MEMS.
Ribbon Bonding (Al/Au ribbons):

Flat wires for high-current applications.
Applications: IGBTs, automotive power modules.

3. Why Do Wire Bonds Fail?
Common failure modes:

Lifted bonds (poor adhesion)—caused by contamination or incorrect force/temperature.
Wire breaks (fatigue)—due to vibration/thermal cycling.
Corrosion (especially Cu)—moisture ingress or halogen contamination.
Mitigation: Proper surface cleaning, inert atmosphere bonding (for Cu), underfill encapsulation.

 
4. How to Inspect Wire Bonds?
Destructive Tests: Pull test (≥3gf for 25µm Au wire), shear test.
Non-Destructive: X-ray imaging, automated optical inspection (AOI).
Electrical Testing: Continuity checks, resistance measurement.