Laser Micro-Etching Equipment

• Customization: Available
• Application: Detector, Diode, Power Electronic Components, IGBT
• Batch Number: 2023+
• Model NO.: HMLA-ME01
• Certification: CCC, CE, EPA
• Manufacturing Technology: Logic IC
• Material: Power Semiconductor
• Model: Hmla-Topcon
• Package: CSP
• Signal Processing: Digital
• Wafer Size: 182mm ~ 230mm (Compatible with Various Rectangular
• Wafer Thickness: 100-180μm
• Throughput: ≥4000 PCS/H @182mm×182mm
• Pattern Accuracy: ≤±15μm @182mm
• Transport Package: Wooden Package
• Specification: 0*0*0
• Trademark: Himalaya
• Origin: China
• Production Capacity: 5000

Product Description

Product Description

Product Features

1. Ultra-fast laser processing system + F-T homogenization shaping technology, non-destructive ablation of various oxide films, passivation films and other materials
2. Square spot size can be customized according to customer requirements, meeting different process needs
3. Fine control of graphics, maintaining precise isolation and partition of P/N areas
4. Self-developed high-precision visual algorithm, achieving high-precision positioning
5. High production capacity, high precision, high uniformity, high stability
6. Equipped with multiple online detection functions to ensure high yield of products
7. Modular design, can be selected according to customer requirements, with strong compatibility

Technical Specifications

• Applicable Wafer Size: 182mm ~ 230mm (compatible with various rectangular substrates)

• Applicable Wafer Thickness: 100-180μm

• Throughput: ≥4,000 pcs/h @182mm×182mm

• Pattern Accuracy: ≤±15μm @182mm

• Loading/Unloading Method: AGV-compatible dual-layer dual-track or single-layer dual-track I/O

• Cassette Capacity: 5×2 + 1 + 1

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

 

Field Application

 

 

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.