Fully Automatic Die Bonding Machine System Manufacturer

Product Description

Fully Automatic Die Bonding Machine System manufacturer

Product Description

This series of soft solder die bonding machines is the most accurate and fastest 8-inch (downward compatible with 6-inch) soft solder die bonding machine in the world. Its production capacity and accuracy have reached the same level as imported equipment from Europe and the United States. The advanced gas-heat track structure design leads the industry in oxygen content control. The wafer stage, XY die bonding, and double-drawing tin system of the SD800/PLUS/+ models are designed in a straight line to provide high-quality quality control for your products.

SD800 is mainly used for single-row lead frame packages, such as TO263 & TO220 & TO247 &
TO3P, etc.
SD800 supports tinning/writing/pressing functions.
Supports Map function.
SD800 track width up to 70mm

Detailed Photos

              

Product Parameters

Increase UPH-using linear control system

Higher MTBA-less downtime and better pattern recognition
High-precision welding head height reading
Various bonding timing adjustments
Linear ejector control methods
Hidden heating system
8-stage track temperature control system
Track ultra-low oxygen content control
Can be equipped with composite loading methods
Select the machine connection device to connect 2 devices of the same model
Support Map function
Optional GSM function
Various wafer disc structures (optional)
Various tin writing path operation methods

Specification

SD800 Equipment Specification Summary

 

 

Category	Parameter	Specification / Range	Details / Notes
General	Model	SD800
	Productivity	3 - 5k units/hour	For point tinning, press tinning, and single-row lead frames
	Machine Size (WxDxH)	1,900 x 1,200 x 1,700 mm
	Machine Weight	~1,300 kg
	Track Width	70 mm	Standard
	Welding Head	Standard welding head
Solder Process	Solder Thickness	1 - 3 mil
	Soft Solder Voids	≤ 2% (single void) ≤ 5% (total chip area)
	Soft Solder Coverage	100%	Chip-to-pad edge clearance: >10 mil
	XY Soldering Position Accuracy	± 2.7 mil (± 70 µm), ± 2°
Wafer Tilt	Chip Size ≤ 150x150 mil	< 2 mil	Tilt angle specification
	Chip Size > 150x150 mil	< 1°	Tilt angle specification
Material Handling	Wafer (Die) Size	20x20 - 560x560 mil (0.5x0.5 - 14x14 mm)
	Substrate Length	4.33" - 11.81" (110 - 300 mm)
	Substrate Width	0.47" - 2.75" (12 - 70 mm)
	Substrate Thickness	4 - 39 mil (0.1 - 1 mm)
	Box Length	4.33" - 11.81" (110 - 300 mm)
	Box Width	0.63" - 4.72" (16 - 120 mm)
	Box Height	2.68" - 6.30" (68 - 160 mm)

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonding,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
 

Packaging & Shipping

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:Why choose us ?
A3:OEM/ODM/Designing.