High Quality PCB laser marking system
This system realizes fully automatic online dynamic marking for the PCB industry, and achieves fully automatic loading and unloading through the SMEMA standard interface.
Features:
1.PCB blue oil, green oil, white oil, copper plate and other laser marking applications.
2.Machinable characters, bar codes, two-dimensional codes, trademark logo, etc.
3.High Precision CCD Positioning and two dimensional code recognition.
4.The width of the tracks can be adiusted, the orientation of the board in and out of the board is optional.
5.Fully automatic online, can connect to SMT flow line, support SMEMA standard.
Product Parameters
Specifications:
| Laser |
Scan Range |
Maximum Power Consumption |
Operating Height |
Sample size |
Device Dimensions |
Weight of equipment |
| Optical fiber /green light /Uv/C02 |
50x50mm ^ 2 (customizable) |
2.5kW |
900±20mm |
50x50mm^2-460x510mm^2 |
1000x600x1700mm^3 |
Lessthan1.5tons |
Our Advantages
1, Innovation-Driven Solutions
Pioneering advanced semiconductor equipment (Laser Cutting/Die Bonding/Wafer Dicing) with 10+ patents, constantly evolving for emerging tech nodes.
2, Global Compliance & Quality
ISO 9001 & CE certified manufacturing, ensuring precision (±5µm) and reliability for fab-ready integration.
3, End-to-End Customer Support
24/7 technical assistance + on-site training, minimizing downtime and maximizing your yield.
4, Worldwide Logistics Network
Efficient SECURE & TIMELY global shipments (30+ countries), with customs-cleared documentation.
5, Sustainable Manufacturing
Eco-conscious production: FFU filtration, energy-efficient lasers, and waste-reduction protocols.
Key Features:
Multi-material (PCB/IC/metal/glass/ceramics)
On-the-fly marking & encoder sync
10μm precision | 100K+ hours lifespan
MES/ERP integration
Applications:
• Electronics: PCB/wafer traceability
• Metal: Deep engraving
• Medical: Biocompatible marking
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
1. What materials can your laser marking systems process?
Our systems support:
- Electronics: PCBs, IC wafers, flex circuits
- Metals: Stainless steel, aluminum, titanium
- Non-metals: Glass, ceramics, composites
2. What's the smallest character size achievable?
- Standard: 0.05mm (50μm)
- High-precision (UV laser): Up to 0.01mm (10μm) for IC wafers or micro-components
3. Can the system integrate with automated production lines?
Yes. Features include:
- On-the-fly marking (up to 1,000+ parts/minute)
- Encoder synchronization for conveyor/robot arms
- MES/ERP connectivity for dynamic data (QR codes, serial numbers)
4. How does laser marking compare to inkjet/mechanical engraving?
| Method |
Laser Marking |
Inkjet |
Mechanical |
| Permanence |
High (chemical change) |
Low (smudges) |
Medium (wear) |
| Speed |
★★★★★ (ms/character) |
★★★☆☆ |
★★☆☆☆ |
| Precision |
10μm-100μm |
100μm+ |
50μm+ |
5. Is the process safe for delicate materials like thin glass or PCBs?
- Cold laser (UV/Green): Zero thermal stress (ideal for wafers/glass)
- Parameter presets: Avoid cracking/over-etching
6. What after-sales support do you provide?
- 24/7 remote diagnostics
- On-site training & maintenance (global coverage)
- 1-3 year warranty (extendable)
7. Can you mark black/color-contrasted codes on metals?
Yes. Techniques include:
- Black annealing (stainless steel)
- White oxidation (aluminum)
- Color-change polymers (plastics)
8. How long does a laser source last?
- Fiber laser: 80,000-100,000 hours
- UV laser: 30,000-50,000 hours
Audited Supplier 
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