Electron Beam Lithography 7*24 Hours Long Processing Capacity

• Customization: Available
• Certification: ISO9001, CCC, JIS
• Protection: Corrosion Resistance
• Model NO.: CABL-AP
• Installation: Vertical
• Housing: Cold Rolled Steel
• Transport Package: Wooden Box
• Origin: Japan
• HS Code: 8415809010
• Production Capacity: 10

Product Description

Advantages

It is the best model for production of DFB-Laser diode for optical communication devices and for Academic and R&D as well. We realize high resolution and high throughput with 50kV.

Beam diameter:

< 2 nmΦ  (for Academic and R&D) 
< 4 nmΦ  (for Production)  
Accerelation voltage: 50kV, 30kV
Stage size: 4 inch, 6 inch ,8 inch wafer model

Features

(1) Electron beam directly write without using photomasks.

(2) Different from laser lithography without photomask, applicable to <500nm characteristic line width requirement, also be available to afford the 7*24hours long processing.

(3) High resolution as same as 100kV

(4) High accurate stitch writing for long time by specially designed laser interferometer

(5) Multi-user environment (PC controlled EOC = Recipe)

(6) Self environment control - Thermal & noise free

(7) Flexible writing methods (vector, vector R-theta, raster, spot, axial symmetrical, field size modulation, multi-mode, 3D)

Specification

Electron Emitter/Acceleration voltage	TFE (ZrO/W)/5 to 50kV
Min. beam diameter	2.0nm (for Academic and R&D)  4.0nm (for Production)
Advanced lithography functions (Optional)	Field size modulation lithography, axial symmetry pattern lithography
Field size	sq. 30μm - sq. 1000μm (50kV) (for Academic and R&D)  sq. 30μm - sq. 1500μm (50kV) (for Production)
Work piece size	4,6,8inchΦ
CAD software	Dedicated CAD (Standard), GDS II conversion (Optional), DXF conversion (Optional)
OS	Windows
UI	English

Packing & Delivery

Company Profile

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in exporting business and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!

We manufacture equipments for Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting(Glass Ceramics Wafers Packaging, Laser Internal Modification Machine Si /Sic Wafe, Laser Internal Modification Machine Lt/Ln Wafer, Laser Annealing Machine for Si/Sic, Automatic Dicing Saw Machine(Wafer Packaging)), Automatic Silicone Dispensing Equipment.

As well as we provide some solutions for handling exhausted metal sorter equipments, customized coating and plating machine, TGV & manual/semiautomatic/automatic equipments, so on.