| Customization: | Available |
|---|---|
| Application: | Detector, Diode, Power Electronic Components, IGBT |
| Batch Number: | 2023+ |
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Ion implantation technology has the following characteristics: single-sided collimation doping, good doping uniformity and controllability, singularity of doping elements, and it is very easy to achieve the graphical representation of doping regions.
These characteristics bring advantages to the manufacturing of crystalline silicon solar cells that thermal diffusion does not possess - not only can high-quality PN junctions be formed and the conversion efficiency of the cells be improved, but also the manufacturing processes of various high-efficiency cells can be greatly simplified: the production of conventional cells can eliminate the removal of phosphosilicon glass and edge etching processes; The production of double-sided batteries can eliminate the masking process. Furthermore, the zonal doping necessary for back-contact batteries can eliminate the alignment process, thereby significantly reducing the manufacturing cost of such batteries. Ion implantation is an economical and reliable technology for improving battery efficiency and manufacturing high-efficiency batteries.
In addition, as toxic emission processes such as phosphorus/boron diffusion, dephosphorization/borosilicate glass, and edge etching are eliminated, ion implantation can significantly reduce the environmental pollution caused by the production of solar cells.
Equipment features:
High productivity
It features a continuous tablet feeding function, with a single-machine production capacity of up to 1,800 tablets per hour, making it possible for a production line to be equipped with only one machine and fully achieving a good match with the existing production line's capacity.
It occupies a small area
Covering an area of 22 square meters, technological upgrades can be achieved without changing the existing production line layout.
The manufacturing process cost is low
The manufacturing process cost is only 60% of that of similar products, with low investment and a short payback period.
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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