Ultrasonic Scanning Microscope

Product Details
Customization: Available
After-sales Service: 1 Year
Warranty: 1 Year
Diamond Member Since 2023

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  • Ultrasonic Scanning Microscope
  • Ultrasonic Scanning Microscope
  • Ultrasonic Scanning Microscope
  • Ultrasonic Scanning Microscope
  • Ultrasonic Scanning Microscope
  • Ultrasonic Scanning Microscope
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  • Overview
  • Product Description
  • Exhibition & Customers
  • Field Application
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Model NO.
HMLA-CS3
Magnification
500-1000X
Type
Stereomicroscope
Number of Cylinder
Monocular
Mobility
Desktop
Stereoscopic Effect
Stereoscopic Effect
Kind of Light Source
Ultraviolet
Shape
Rectangular Prism
Usage
Semiconductor Device and Packaging Inspection
Principle
Optics
Principle of Optics
Polarizing Microscope
Transport Package
Wooden Package
Specification
0*0*0
Trademark
Himalaya
Origin
China
Production Capacity
5000

Product Description

Ultrasonic Scanning Microscope

The ultrasonic scanning microscope is an extremely practical non-destructive testing tool. This product mainly utilizes high-frequency ultrasonic waves to inspect various semiconductor devices and materials. It can detect internal defects such as pores, cracks, inclusions, and delamination in the samples, and present the results graphically. During the scanning process, it does not cause damage to the samples or affect their performance. Therefore, it is widely used in semiconductor device and packaging inspection, material inspection, IGBT power module product inspection, and other scenarios.



Technical features:
1. Supports A, B, C scanning, transmission scanning, multi-layer scanning, JEDEC tray scanning, thickness measurement, etc. scanning modes.
2. Can display the position, shape, and size of internal defects of the tested components in the form of images, and conduct statistics on the size and area of the defects, automatically calculating the percentage of the defects in the measured area.
3. The scanning axis uses linear motor and grating ruler feedback to achieve higher motion accuracy, with a maximum resolution of 0.1 μm.
4. Suitable for rapid scanning analysis of individual components, and can also batch place samples for synchronous defect identification, quickly screening out non-conforming products.
5. The ultrasonic system has a wide bandwidth range and compatible ultrasonic probes with frequencies ranging from 1 to 300 MHz.
6. The NDTS ultrasonic scanning detection software equipped on the device is independently developed by Guanglinda, with a Chinese operation interface that is easy to read. The functions can be continuously upgraded according to customer needs.

Application fields:
1. Semiconductor devices and packaging inspection:
Discrete devices (IGBT/SiC), ceramic substrates, plastic-encapsulated ICs, optical devices, microwave power devices, MEMS devices, flip-chip, stacked Die, MCM multi-chip modules, etc.
2. Material inspection:
Ceramics, glass, metals, plastics, welded parts, water-cooled heat sinks, etc.
3. IGBT power module product inspection:
Realize non-destructive testing of internal interface and structure defects of IGBT modules, accurately find problems in the materials and processes of IGBT modules, screen out non-conforming products, and promote the improvement of IGBT module packaging quality.
 
Product Description
 
 
 
Exhibition & Customers

Ultrasonic Scanning MicroscopeUltrasonic Scanning MicroscopeJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

 

Field Application

 

Ultrasonic Scanning Microscope

 

Packaging & Shipping

 

Ultrasonic Scanning Microscope
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 


 

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