| Customization: | Available |
|---|---|
| After-sales Service: | Provided |
| Warranty: | 24 Months |
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Overview
The series paper & plastic packaging machine is a new type of equipment developed by our technical department based on the mature pharmaceutical packaging technology accumulated over 20 years, combined with the working principles of similar foreign machines. It features advanced technology, full functions, reasonable process, simple operation, and easy maintenance. I stick the tax ticket, and finally the material will be automatically discharged.
Application Range
Applicable for paper & plastic or blister packaging of batteries, stationery, food, medical devices, toys, hardware, electronics, auto parts, daily necessities, cosmetics and other products such as syringes, toy cars, scissors, flashlights, batteries, spark plugs, lipsticks, clothing hooks, cleaning balls, razors, correction fluid, pencils, etc.
Main technical parameters
| Max. Paperboard Size | 390 X 200mm |
| Max. PVC Size | 350 X 160mm |
| Max. Forming Area | 320 X 160 X 40mm |
| Max. Forming Depth | Standard:40mm Special:60mm |
| Cutting Frequency | 10-20 times/minute |
| Stroke Range | 40-200mm |
| Compressed Air Pressure | 0.5-0.8Mpa |
| Compressed Air Flow Rate | ≥ 0.5m3/min |
| Total Power | 380V 50Hz 10.5KW |
| Main Motor Power | 1.5KW |
| Overall Dimension | 3200 X 2200 X 1900mm (LxWxH) |
| Machine Total Weight | 2000KG |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:Why choose us?
A3:OEM/ODM/Designing service.
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