| Customization: | Available |
|---|---|
| Application: | Detector, Diode, LCD Display Controller, Power Electronic Components, Television |
| Batch Number: | 2023+ |
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HMLA-S platform is an off-line automatic micro assembly system developed by the company, which can be equipped with nozzle heating module, material tray/wafer placing plate, ultrasonic module, laser heating module, UV dispensing and curing module, hot nitrogen and formic acid process protection gas module, base preheating module, process monitoring module, chip flip welding module.
The platform features a marble bridge structure and core motion-related components from the ELMO drive system and TECNOTION, a top line Dutch linear drive motor which achieves a 0.1 μ resolution and 0.5 μ single-axis repeat positioning accuracy.
Company's software system integrates equipment internal temperature control, mount precision self-tuning, mount data analysis and other functional modules. We can customize the process, software and module for different customer requirements, and combine the application of equipment with the actual process depth of customers.
|
type |
HMLA-5S |
HMLA-10S |
Lighting system |
RGB panchromatic ring light source |
|
Mounting accuracay |
±2.5μm 3sigma |
±5μm 3sigma |
Process monitoring system (optional) |
Can be record |
|
Way of work
|
Off-line automatic |
Off-line automatic |
Gripper pickup tool head |
customized |
|
Operating range |
200*300mm |
200*300mm |
Suction nozzle |
customized |
|
Mount device size range |
0.03-40mm |
0.03-40mm |
Fixed feeding method |
Gel-pack,Tray,Waferpack etc, |
|
Comprehensive mounting accuracy |
±2.5μm 3sigma |
±5μm 3sigma |
Eutectic module (optional) |
30ºC~500 |
|
XY driven form |
Linear motor |
Linear motor |
Process protection gas (optional) |
Hot nitrogen |
|
Displacement distance |
X:300mm Y:350mm |
X:300mm Y:350mm |
Dispensing system (optional) |
Musashi dispensing system is compatible with UV dispensing, epoxy dispensing and silver dispensing |
|
|
Z:150mm T:360° |
Z:150mm T:360° |
Curing system (optional) |
Uv curing/heat curing |
|
XY resolution |
0.5μ |
1μ |
Height measurement (optional) |
0.005mm Keenshi laser measures 0.005 mm |
|
Z resolution |
0.5μ |
1μ |
Laser hot pressing bonding system (optional) |
MicroASM 25-1000ºC |
|
T resolution |
0.003° |
0.005° |
Ultrasonic hot pressing bonding system (optional) |
MicroASM 25~450ºC |
|
Bonding force control |
20-500g |
20-500g |
Access requirements |
220 power 10a0.5 mpa compressed air |
|
Upper visual system |
1μ |
2μ |
Dimensions and weight |
1050X1550X1850mm(not including monitor)1800kg |
|
Lower visual system |
1μ |
2μ |
weight |
1000kg |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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