Ultrasonic Wedge Bonder semiconductor Wire bonding device Semiconductor Aluminum Wire welding Machine
The Himalaya wedge bonder is built on a redesigned architecture that includes an expanded bonding area, new powerful pattern recognition capabilities and extremely tight process control. Together they improve productivity, bonding quality and reliability. The expanded bondable area enhances flexibility and reduces line integration costs. The Himalaya is driven by a precise new direct drive motion system that requires minimal maintenance and provides high repeatability. Graphical editors, multi-segment bonding, global parameter changes and new software function libraries make programming of complex devices and optimization of the bonding process relatively easy.
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Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:Why choose us ?
A3:OEM/ODM/Designing.
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