Sic Laser Annealing Equipment Thin Chip Wafers Micro LED Wafer Laser Mass Transfer System

• Customization: Available
• After-sales Service: Provided
• Condition: New
• Certification: ISO
• Warranty: 12 Months
• Automatic Grade: Automatic
• Product Name: Laser Annealing Equipment Semiconductor
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China
• Production Capacity: 5000

Product Description

Sic Laser Annealing Equipment compatible with 4 6 8 Inch Thin Chip Wafers Micro LED Wafer Laser Mass Transfer System
 

Product Description

Laser Annealing Machine for Sic

Equipment features:
1. Modular design and integration of the entire machine, compatible with 4, 6, and 8-inch thin chip wafers
2. Integrated self-developed advanced laser shaping technology, with highly uniform and stable spot energy
3. After annealing, the surface is uniform and flat, exhibiting excellent electrical and surface morphology characteristics
4. Strictly control the oxygen content in the cavity, effectively control the amount and distribution of surface carbon precipitation
5. Configure a monitoring and compensation system to monitor optical energy stability and non annealed surface temperature
6. Equipped with EFEM transmission system, the whole machine complies with SEMI standards and supports SECS-GEM communication

Application scope: Annealing transition metals deposited on heavily doped silicon carbide (SiC) surfaces to form good Ohmic contacts

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:Why choose us ?
A3:OEM/ODM/Designing.