Ceramic Laser Cutting Machine Series Ceramic Laser Cutting, Punching and Marking Machine

Product Details
Customization: Available
After-sales Service: Provide
Function: Anti-Corrosion, Anti-Cold
Diamond Member Since 2023

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  • Ceramic Laser Cutting Machine Series Ceramic Laser Cutting, Punching and Marking Machine
  • Ceramic Laser Cutting Machine Series Ceramic Laser Cutting, Punching and Marking Machine
  • Ceramic Laser Cutting Machine Series Ceramic Laser Cutting, Punching and Marking Machine
  • Ceramic Laser Cutting Machine Series Ceramic Laser Cutting, Punching and Marking Machine
  • Ceramic Laser Cutting Machine Series Ceramic Laser Cutting, Punching and Marking Machine
  • Ceramic Laser Cutting Machine Series Ceramic Laser Cutting, Punching and Marking Machine
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  • Overview
  • Product Description
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Model NO.
HMLA-CRM01
Demoulding
Pull Core
Condition
New
Certification
ISO
Warranty
12 Months
Automatic Grade
Automatic
Installation
Vertical
Driven Type
Electric
Mould Life
<300,000 Shots
Product Name
Ceramic Laser Cutting Machine
Advantage
Factory Price
After-Sale Service
Provided
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

Product Description
 
Ceramic Laser Cutting Machine Series Ceramic Laser Cutting, Punching and Marking Machine
This model adopts the most advanced semiconductor fiber laser in the world. The beam quality is good, the volume is small, and the photoelectric conversion efficiency is high. Long term use, maintenance free, low cost, low power consumption and other advantages.


Advantage

1. This model adopts the most advanced semiconductor fiber laser in the world. The beam quality is good, the volume is small, and the photoelectric conversion efficiency is high. Long term use, maintenance free, low cost, low power consumption and other advantages.

2. Adopting marble precision platform and XY separated closed structure, it has good rigidity, shock resistance, and high-speed stability.

3. It adopts magnetic suspension imported linear motor, 0.1um high-precision grating ruler and full closed-loop bus CNC system, which has high response speed, high precision and low maintenance rate.

4. It is mainly used for laser cutting and drilling of AL2O3,ZrO2, AIN, SI3N4 and other advanced precision ceramics.

5. With CCD vision positioning system, it can also be used for cutting and marking of metallized ceramics and chip substrate.


Application
  • ndustrial products: various industrial ceramic accessories and molds.
  • PCB industry: ceramic circuit board cutting, drilling and marking.
  • 3C industry: various ceramic substrates, mobile phone ceramic backboard, middle frame, wearing digital products, etc
  • New energy industry: ceramic devices such as solar photovoltaic equipment, automotive sensors, hydrogen fuel cells, etc.
Parameter
 

NO

Project  

  Specifications

1

 Laser wavelength

1060-1080nm

2

Laser output power

150W

3

Max.cutting range

                        300*300mm

4

Cutting thickness

  0.2-5mm(Depending on material)

5

Precision of repeated positioning of X/Y axis

±3um

6

Processing speed

0-2500mm/min

7

Maximum distance speed

60m/min

8

 Maximum acceleration

1.0G

9

Worktable precision

<=0.015mm

10

Transmission mode

linear motor +0.1um linear encoder Imported linear motor +0.1um grating ruler

11

Whole machine power (no fan)

      <=6KW

12

Total weight of the whole machine

(about)1700KG

13

External dimension(length*width*height)   

1400*1500*1800mm

()



Sample

Ceramic Laser Cutting Machine Series Ceramic Laser Cutting, Punching and Marking Machine

 
Exhibition & Customers

Ceramic Laser Cutting Machine Series Ceramic Laser Cutting, Punching and Marking MachineCeramic Laser Cutting Machine Series Ceramic Laser Cutting, Punching and Marking MachineJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

Ceramic Laser Cutting Machine Series Ceramic Laser Cutting, Punching and Marking Machine
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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