Silicon Carbide Ingot Laser Slicing Equipment

Product Details
Customization: Available
Warranty: 12 Months
Transport Package: Complies with International Logistics Standards
Diamond Member Since 2023

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  • Silicon Carbide Ingot Laser Slicing Equipment
  • Silicon Carbide Ingot Laser Slicing Equipment
  • Silicon Carbide Ingot Laser Slicing Equipment
  • Silicon Carbide Ingot Laser Slicing Equipment
  • Silicon Carbide Ingot Laser Slicing Equipment
  • Silicon Carbide Ingot Laser Slicing Equipment
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  • Overview
  • Product Description
Overview

Basic Info.

Model NO.
DLDS-8680
Trademark
Himalaya
Origin
China
Production Capacity
50000

Product Description

Silicon carbide ingot laser slicing equipment
 
Product Description

This equipment is used for laser slicing processing of silicon carbide ingots/sheets, and after the laser processing is completed, it cooperates with the auxiliary slicing device to complete the slicing of wafers after cutting. The material loss is small, the processing efficiency is high, the equipment operation does not require consumables, and the processing cost is low.
 

 Equipment advantages

1. Low material loss

2.High processing efficiency
3. No consumables are required for equipment operation

4.Low processing cost

 

Silicon Carbide Ingot Laser Slicing Equipment

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