| Customization: | Available |
|---|---|
| After-sales Service: | 1 Year |
| Warranty: | 1 Year |
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This fully-automatic single spindle grinder is suitable for grinding 4"-12" wafers. The machine is equipped to load and unload wafers, and it is integrated with automatic centering, cleaning, and drying functions. This machine is also equipped with an automatic thickness measurement and compensation system. It can realize automatic grinding processing of wafers from cassette to cassette, and complete dry-in and dry-out processing.
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