| Customization: | Available |
|---|---|
| After-sales Service: | Provide |
| Warranty: | 12 Months |
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In the rapidly evolving semiconductor industry, precision and efficiency in wafer processing are critical to maintaining high yields and reducing production costs. The MET-5600 Fully Automatic Wafer Chamfering Machine is a state-of-the-art solution designed to deliver ultra-precise edge profiling for semiconductor wafers, ensuring minimal material loss, superior surface finish, and crystal orientation accuracy.
Ideal for semiconductor fabrication, optoelectronics, and MEMS manufacturing, the MET-5600 is engineered to meet the stringent demands of 300mm fabs, R&D labs, and compound semiconductor production. Whether processing SiC for power devices or GaAs for photonics, this machine ensures repeatable, high-quality results.
By integrating smart sensing, automated alignment, and real-time process monitoring, the MET-5600 guarantees efficiency and reliability-future-proofing your wafer edge preparation process.
| Parameter | Specification |
|---|---|
| Grinding Precision | Sub-micron level edge uniformity |
| Material Loss Rate | <0.1% (optimized for minimal kerf loss) |
| Orientation Accuracy | ±0.1° crystal alignment |
| Throughput | Adjustable based on wafer material/hardness |
| Automation Level | Full CNC control with robotic wafer handling (optional) |
| Cooling System | Integrated DI water/spray cooling to prevent thermal stress |
| Compliance Standards | SEMI/SECS/GEM compliance for fab integration |
| Attribute | Specification |
|---|---|
| Equipment Type | Fully automatic wafer edge chamfering/grinding machine |
| Compatible Wafer Sizes | 4-inch, 6-inch, 8-inch diameters |
| Supported Materials | Silicon (Si), Indium Phosphide (InP), Gallium Arsenide (GaAs), Silicon Carbide (SiC), Sapphire, Bonded Wafers, Glass Wafers |
| Machine Dimensions | 2.2 m (L) × 1.5 m (W) × 2.2 m (H) |
| Weight | 3 tons |
| Key Advantages | High precision, minimal material loss, stable operation, accurate crystal orientation positioning, superior surface finish |
| Typical Applications | Semiconductor wafer edge profiling, post-cutting chamfering, defect-free edge finishing |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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