Small Versatile Lithography Product Equipped with MLC600 Maskless Lithography System

• Customization: Available
• After-sales Service: Provided
• Function: Abrasion Resistance, High Temperature Resistance, Anti-Corrosion
• Model NO.: SML-01
• Demoulding: Pull Core
• Condition: New
• Certification: RoHS, ISO, CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Driven Type: Electric
• Mould Life: 300,000-1,000,000 Shots
• Product Name: Electron Beam Evaporation Coating Equipment
• Voltage: 6000V, 2000V, 1000V, 500V
• Current: 300A, 200A, 100A, 30A, 10A
• Input: AC 220 to 240V +/- 10%, 50Hz/60Hz
• Capacity: 250va
• Relay Move Time: 2ms to 100ms
• Main Unit: 492(W) × 670(D) × 250(H) mm
• Test Station (HD-1200): 80(W) × 272(D) × 169(H) mm
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China
• Production Capacity: 100

Product Description

Small Versatile Lithography Product  Equipped With MLC600 Maskless Lithography System 

Product Description

Measurement Precision:

Current Range	Precision	Voltage Range	Precision
10nA	±(1% + 0.04% FS + 3nA)	1mV	±(3% + 0.04% FS + 50μV)
10mA	±(0.5% + 0.04% FS + 3nA)	10mV	±(0.5% + 0.04% FS + 50μV)
10A (ALL)	±(0.5% + 0.04% FS + 3nA)	1kV (FULL)	±(0.5% + 0.04% FS + 20mV)

 

Key Specifications:

1. Voltage/Current Ranges:

• Voltage: 6000V, 2000V, 1000V, 500V (optional)

• Current: 300A, 200A, 100A, 30A, 10A (optional)

2. Power Supply:

• Input: AC 220-240V ±10%, 50Hz/60Hz

• Capacity: 250VA

3. Relay Move Time: 2ms-100ms (default: 3ms)

4. Dimensions:

• Main Unit: 492(W) × 670(D) × 250(H) mm

• Test Station (HD-1200): 80(W) × 272(D) × 169(H) mm

System Features:

• 2-Channel test capability

• 24 binary classification signals

• Support for multi-handler configuration (e.g., QT-4100A master controller)

• Ping Pong Test and Parallel Test modes for efficient production testing
   

Product Overview

The MLC600 is a compact, multi-functional lithography system developed by Hefei Circuit Fabology Microelectronics Equipment Co., Ltd. Designed specifically for universities and research institutions worldwide, it offers flexible capabilities, small footprint, and excellent cost-performance ratio.

 

Key Features

Key Features and Advantages

1. Direct Writing on Devices

   • Enables direct lithography on substrates/devices for rapid prototyping
   • Example: Writing precise circuit patterns for micro-sensor elements

2. Photomask Fabrication

   • Creates high-quality photomasks for conventional lithography processes
   • Essential for IC manufacturing and MEMS device production

3. 3D Structure Lithography

   • Capable of creating complex three-dimensional microstructures
   • Applications: Microfluidic channels, MEMS devices, optical components

4. Advanced Alignment Systems

   • Automatic alignment (±500nm overlay accuracy)
   • Backside alignment capability
   • Custom alignment mark support
   • Visual fixed-point exposure

5. Precision Features

   • Auto-focus system
   • Supports both high-resolution (0.6μm) and high-throughput modes
   • Accommodates small batch production with various designs

6. Light Source Options

   • Standard 405nm laser diode (375nm optional)
   • Optimized for common photoresists

7. Software Compatibility

   • Supports multiple design formats: GDS II, Gerber, ODB++
   • Windows-based GUI for user-friendly operation

Product Parameters

Technical Specifications (MLC600 Models I & II)
Parameter	Unit	MLC600-I	MLC600-II
Max. Panel Size	Inch	8 (Scalable)	8 (Scalable)
Max. Exposure Area	mm²	200×200	200×200
Resolution	μm	0.6	2
Data Grid Accuracy	nm	70	140
CD Uniformity (3σ)	nm	150	300
Overlay Accuracy (3σ)	nm	500	500
Throughput	mm²/min	250	1000

Typical Applications

• Academic Research: Micro/nano device prototyping, photonics research
• R&D Labs: MEMS development, advanced packaging
• Small-scale Production: Custom ICs, specialized sensors

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
 

 

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:Why choose us?
A3:OEM/ODM/Designing service.